| 모델 P/N | 시리즈 | 실험실/CLBS 수 | 속도 등급 | 논리 요소/셀 수 | 총 램 비트 | I/O 수 | 전압 - 공급 | 마운팅 유형 | 작동 온도 | 패키지 / 케이스 | 공급업체 디바이스 패키지 |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC5VFX130T-2FF1738I | Virtex-5 FXT | 10.240,00 | -2,00 | 131072 | 10985472 | 840 | 0.95V-1.05V | 표면 실장 | -40°C ~ +100°C | 1738-FBGA, FCBGA | 1738-FCPBGA(42.5×42.5mm) |
Xilinx XC5VFX130T-2FF1738I | Virtex-5 FXT Industrial Grade High-Performance FPGA
그리고 XC5VFX130T-2FF1738I is a flagship FPGA engineered for ultra-demanding industrial and mission-critical systems. This device represents the high-performance tier of the Virtex-5 FXT family, combining 속도 등급 -2 efficiency with a rugged 산업용 온도 범위 (-40°C ~ +100°C). With dual PowerPC® 440 cores and 20 high-speed GTX 트랜시버, it provides a robust platform for complex data-path acceleration in harsh environments.
에서 LXB 세미콘, we specialize in high-value, high-reliability Xilinx silicon, providing fully verified and traceable XC5VFX130T-2FF1738I units to our global partners.
핵심 기술 사양
The XC5VFX130T is one of the largest devices in the FXT sub-family, optimized for maximum I/O and processing density:
| 기능 | 상세 사양 |
| 논리 셀 | 131,072 |
| 속도 등급 | -2 (성능 향상) |
| 작동 온도 | -40°C ~ +100°C(산업용 등급) |
| 임베디드 프로세서 | 2 x PowerPC® 440 Blocks |
| RocketIO™ GTX | 트랜시버 20개(최대 6.5Gbps 지원) |
| DSP48E 슬라이스 | 320 |
| 최대 사용자 I/O | 840 |
| 패키지 | FF1738 (1738-pin Flip-Chip BGA) |
Why the “2I” Configuration is Critical for Your Design
For systems operating at the edge of performance and environmental limits, the XC5VFX130T-2FF1738I offers distinct advantages:
1. Industrial-Grade Thermal Resilience
그리고 -I 등급 ensures that the FPGA maintains timing closure and logic stability under extreme cold and heat (-40°C to +100°C). This is a non-negotiable requirement for outdoor telecom infrastructure, avionics, and heavy industrial automation.
2. Superior Timing with -2 Speed Grade
그리고 속도 등급 -2 provides faster clock speeds and lower propagation delays than the standard -1 grade. In a design utilizing over 130k logic cells, this extra margin is often the difference between a system that meets its timing constraints and one that requires costly redesign.
3. Massive Processor & I/O Density
The integration of dual PowerPC cores allows for sophisticated hardware/software partitioning. Combined with 840개의 사용자 I/O, this chip can act as a centralized controller for massive sensor arrays or complex backplane communication systems.
4. Legacy Reliability in FF1738 Package
The large 1738-pin package is designed for maximum signal grounding and thermal dissipation, ensuring high signal integrity (SI) for the 20 GTX transceivers operating at multi-gigabit speeds.
고부가가치 애플리케이션
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방위 및 항공우주: Radar signal processing and ruggedized mission computers.
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Energy & Infrastructure: Smart grid protection systems and power station monitoring.
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통신: High-capacity base stations and core optical networking.
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Specialized Computing: Hardware-in-the-loop (HIL) simulators and financial modeling accelerators.
The LXB Semicon Assurance: Quality & Traceability
When procuring a high-value component like the XC5VFX130T-2FF1738I, the pedigree of the supplier is paramount. LXB 세미콘 ensures your investment is protected:
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Authenticity Guaranteed: Every component is 100% original Xilinx (now AMD) silicon. We provide thorough incoming inspections to ensure factory-new condition.
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Industrial Traceability: We provide Date Code (D/C) and Lot Code information, supporting the strict documentation requirements of industrial and military-grade procurement.
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전문가 처리: Large BGA packages like the 1738 are sensitive to moisture and ESD. We use vacuum-sealed, moisture-barrier packaging and strict ESD protocols to ensure the integrity of the BGA balls and the silicon.
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Longevity Support: We maintain stock for legacy Virtex-5 parts to help our clients avoid the risks of EOL (End-of-Life) components and production delays.
자주 묻는 질문(FAQ)
Q: Can I use the XC5VFX130T-2FF1738I to replace a commercial grade -1 part?
A: Yes. The -2I version is an “up-grade” that covers the commercial temperature range and exceeds the performance of a -1 speed grade. It is a robust drop-in replacement.
Q: What software is required to program this device?
A: This FPGA is supported by 자일링스 ISE® 디자인 스위트(14.7). Vivado® 플랫폼과 호환되지 않습니다.
Q: Does the “FF1738” package contain lead?
A: Yes, the FF1738 package is a standard leaded BGA. If your project requires a lead-free solution, you should look for the FFG1738 (with the ‘G’ suffix).
Secure Your Supply of XC5VFX130T-2FF1738I
Looking for a bulk quote or have technical questions? Contact LXB 세미콘 today for current availability and competitive pricing.
