| MODELO P/N | SERIE | NÚMERO DE LABORATORIOS/CLBS | GRADO DE VELOCIDAD | NÚMERO DE ELEMENTOS LÓGICOS / CELDAS | TOTAL BITS RAM | NÚMERO DE E/S | TENSIÓN - ALIMENTACIÓN | TIPO DE MONTAJE | TEMPERATURA DE FUNCIONAMIENTO | PAQUETE / ESTUCHE | PAQUETE DEL DISPOSITIVO DEL PROVEEDOR |
|---|---|---|---|---|---|---|---|---|---|---|---|
| ADSP-TS201SABP-060 | ADSP-TS201S (TigerSHARC-R) | 0,00 | 600,00 | N/A | 2400000(≈3 MB) | 0 | VDD_CORE 1,20 V; VDD_IO 2,5 V; VDD_DRAM ≈1,6 V | Montaje en superficie (BGA) | -40 °C a +85 °C | BGA de 576 bolas | 576-BGA-ED (BP-576) |
ADSP-TS201SABP-060
Fabricante: Dispositivos analógicos
Células lógicas: бк
Rebanadas lógicas: бк
RAM integrada (eRAM): 24 Mbits de SRAM integrada en el chip
Paquete: SABP
Temperatura de funcionamiento: De -40 °C a +85 °C
Especificaciones
Part Number Definition
ADSP-TS201S is a classic high-performance floating-point DSP based on TigerSHARC static superscalar architecture, designed for large-scale real-time intensive signal processing and multi-processor array systems.
Suffix code breakdown:
- AB: Standard industrial temperature grade
- BP: Thermally enhanced 576-ball BGA package, outline size 25mm × 25mm
- -060: Rated core operating frequency of 600MHz
This version is non-lead-free construction, shipped in anti-static tray packaging for PCB surface mount assembly. The component has been officially discontinued by Analog Devices.
Core Electrical Performance Parameters
Computing Core Architecture
Combines the advantages of RISC, VLIW and traditional DSP architectures, adopting dual independent computing units with SIMD parallel execution capability. Each arithmetic unit is equipped with ALU, hardware multiplier, barrel shifter and dedicated register group, paired with two independent address generators to accelerate circular addressing and bit-reversal addressing operations required for FFT algorithms.
Supported data formats: 8/16/32/64-bit fixed-point, IEEE 32-bit single-precision floating point, 40-bit extended precision floating point.
Key performance indicators at 600MHz:
- Instruction cycle: 1.67ns
- Peak floating-point throughput: 3.6 GFLOPS
- 1024-point complex FFT calculation time: only 16.8μs
- Ultra-high energy efficiency: 1500 MFLOPS per watt
On-Chip Memory Resources
Total on-chip embedded DRAM reaches 24Mbit (3MB), divided into multiple independent memory banks that can be freely allocated for program storage and data buffering. Multi-group wide internal buses deliver ultra-high internal access bandwidth, effectively eliminating data transmission bottlenecks during continuous algorithm operation. No built-in non-volatile flash memory; application programs must be loaded from external storage after power initialization.
Integrated Peripheral Interfaces
- Four independent high-speed Link Ports: realize seamless glueless interconnection between multiple DSP chips, convenient for building scalable multi-processor parallel computing arrays
- 14-channel zero-overhead DMA controller: completes automatic data transmission between internal memory, external SDRAM, peripherals and inter-chip ports without occupying core computing resources
- Built-in SDRAM memory controller for expanding large-capacity off-chip storage space
- Dual programmable hardware timers, general-purpose flag I/O pins
- IEEE 1149.1 standard JTAG debug port for program download, online emulation and system fault diagnosis
- Host interface for communication with upper-level main control processors
Power Supply Specifications
- Core digital supply voltage: 1.2V
- Digital I/O interface supply voltage: 2.5V
Packaging and Assembly Specifications
Encapsulated in 576-ball thermally enhanced BGA surface-mount package with overall dimensions 25mm × 25mm. The large bottom thermal pad significantly improves heat dissipation efficiency under long-term full-load high-speed operation and stabilizes grounding performance for high-speed digital circuits.
Moisture Sensitivity Level: MSL3. All reflow soldering procedures must be finished within 168 hours after the vacuum sealed package is opened. Anti-static tray packaging is adopted to meet the production requirements of industrial electronic equipment.
Environmental and Compliance Standards
Stable continuous operating temperature range: -40°C ~ +85°C. It can work reliably for a long time in airborne equipment, ground radar stations, medical imaging systems and industrial test instruments with severe temperature changes and strong electromagnetic interference.
This variant does not adopt lead-free process, not fully compliant with current RoHS environmental directives; the corresponding lead-free model is ADSP-TS201SABPZ-060.
Campos de aplicación típicos
Radar echo signal processing, beam forming, target detection and tracking systems
Medical CT, nuclear magnetic resonance, ultrasonic imaging real-time data computing equipment
Underwater sonar acoustic signal acquisition, filtering and post-processing systems
Wireless communication base station broadband signal demodulation, channel equalization and decoding modules
Aerospace airborne navigation, remote sensing data embedded processing platforms
High-end spectrum analyzers, vector signal generators and precision electronic measurement instruments
