ADSP-TS201SABP-060

Производитель: Аналоговые устройства
Логические ячейки: букмекерская контора
Логические срезы: букмекерская контора
Встроенная оперативная память (eRAM): Встроенная SRAM объемом 24 Мбит
Упаковка: SABP
Рабочая температура: от -40 °C до +85 °C

ОТПРАВИТЬ НАМ СООБЩЕНИЕ

    Технические характеристики

    МОДЕЛЬ П/Н СЕРИИ КОЛИЧЕСТВО ЛАБОРАТОРИЙ/КЛБ УРОВЕНЬ СКОРОСТИ КОЛИЧЕСТВО ЛОГИЧЕСКИХ ЭЛЕМЕНТОВ / ЯЧЕЕК ВСЕГО БИТОВ ОЗУ КОЛИЧЕСТВО ВХОДОВ/ВЫХОДОВ НАПРЯЖЕНИЕ - ПИТАНИЕ ТИП КРЕПЛЕНИЯ РАБОЧАЯ ТЕМПЕРАТУРА УПАКОВКА / КЕЙС УПАКОВКА УСТРОЙСТВА ПОСТАВЩИКА
    ADSP-TS201SABP-060 ADSP-TS201S (TigerSHARC-R) 0,00 600,00 Н/Д 2400000 (≈3 МБ) 0 VDD_CORE 1,20 В; VDD_IO 2,5 В; VDD_DRAM ≈1,6 В Поверхностный монтаж (BGA) от -40 °C до +85 °C 576-шариковый BGA 576-BGA-ED (BP-576)

    Определение номера детали

    ADSP-TS201S is a classic high-performance floating-point DSP based on TigerSHARC static superscalar architecture, designed for large-scale real-time intensive signal processing and multi-processor array systems.

    Suffix code breakdown:

    • AB: Standard industrial temperature grade
    • BP: Thermally enhanced 576-ball BGA package, outline size 25mm × 25mm
    • -060: Rated core operating frequency of 600MHz

      This version is non-lead-free construction, shipped in anti-static tray packaging for PCB surface mount assembly. The component has been officially discontinued by Analog Devices.

    Основные электрические рабочие характеристики

    Computing Core Architecture

    Combines the advantages of RISC, VLIW and traditional DSP architectures, adopting dual independent computing units with SIMD parallel execution capability. Each arithmetic unit is equipped with ALU, hardware multiplier, barrel shifter and dedicated register group, paired with two independent address generators to accelerate circular addressing and bit-reversal addressing operations required for FFT algorithms.

    Supported data formats: 8/16/32/64-bit fixed-point, IEEE 32-bit single-precision floating point, 40-bit extended precision floating point.

    Key performance indicators at 600MHz:

    • Instruction cycle: 1.67ns
    • Peak floating-point throughput: 3.6 GFLOPS
    • 1024-point complex FFT calculation time: only 16.8μs
    • Ultra-high energy efficiency: 1500 MFLOPS per watt

    Ресурсы памяти на кристалле

    Total on-chip embedded DRAM reaches 24Mbit (3MB), divided into multiple independent memory banks that can be freely allocated for program storage and data buffering. Multi-group wide internal buses deliver ultra-high internal access bandwidth, effectively eliminating data transmission bottlenecks during continuous algorithm operation. No built-in non-volatile flash memory; application programs must be loaded from external storage after power initialization.

    Встроенные периферийные интерфейсы

    1. Four independent high-speed Link Ports: realize seamless glueless interconnection between multiple DSP chips, convenient for building scalable multi-processor parallel computing arrays
    2. 14-channel zero-overhead DMA controller: completes automatic data transmission between internal memory, external SDRAM, peripherals and inter-chip ports without occupying core computing resources
    3. Built-in SDRAM memory controller for expanding large-capacity off-chip storage space
    4. Dual programmable hardware timers, general-purpose flag I/O pins
    5. IEEE 1149.1 standard JTAG debug port for program download, online emulation and system fault diagnosis
    6. Host interface for communication with upper-level main control processors

    Технические характеристики источника питания

    • Core digital supply voltage: 1.2V
    • Digital I/O interface supply voltage: 2.5V

    Технические требования к упаковке и сборке

    Encapsulated in 576-ball thermally enhanced BGA surface-mount package with overall dimensions 25mm × 25mm. The large bottom thermal pad significantly improves heat dissipation efficiency under long-term full-load high-speed operation and stabilizes grounding performance for high-speed digital circuits.

    Moisture Sensitivity Level: MSL3. All reflow soldering procedures must be finished within 168 hours after the vacuum sealed package is opened. Anti-static tray packaging is adopted to meet the production requirements of industrial electronic equipment.

    Экологические стандарты и стандарты соблюдения нормативных требований

    Stable continuous operating temperature range: -40°C ~ +85°C. It can work reliably for a long time in airborne equipment, ground radar stations, medical imaging systems and industrial test instruments with severe temperature changes and strong electromagnetic interference.

    This variant does not adopt lead-free process, not fully compliant with current RoHS environmental directives; the corresponding lead-free model is ADSP-TS201SABPZ-060.

    Типичные области применения

    Radar echo signal processing, beam forming, target detection and tracking systems

    Medical CT, nuclear magnetic resonance, ultrasonic imaging real-time data computing equipment

    Underwater sonar acoustic signal acquisition, filtering and post-processing systems

    Wireless communication base station broadband signal demodulation, channel equalization and decoding modules

    Aerospace airborne navigation, remote sensing data embedded processing platforms

    High-end spectrum analyzers, vector signal generators and precision electronic measurement instruments