ADSP-TS201SABP-060

제조업체: 아날로그 디바이스
로직 셀: бк
로직 슬라이스: бк
임베디드 RAM(eRAM): 24Mbits 온칩 SRAM
패키지: SABP
작동 온도: 40°C ~ +85°C

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    사양

    모델 P/N 시리즈 실험실/CLBS 수 속도 등급 논리 요소/셀 수 총 램 비트 I/O 수 전압 - 공급 마운팅 유형 작동 온도 패키지 / 케이스 공급업체 디바이스 패키지
    ADSP-TS201SABP-060 ADSP-TS201S(TigerSHARC-R) 0,00 600,00 N/A 2400000(≈3MB) 0 VDD_CORE 1.20V; VDD_IO 2.5V; VDD_DRAM ≈1.6V 표면 실장(BGA) -40°C ~ +85°C 576볼 BGA 576-BGA-ED(BP-576)

    부품 번호 정의

    ADSP-TS201S is a classic high-performance floating-point DSP based on TigerSHARC static superscalar architecture, designed for large-scale real-time intensive signal processing and multi-processor array systems.

    Suffix code breakdown:

    • AB: Standard industrial temperature grade
    • BP: Thermally enhanced 576-ball BGA package, outline size 25mm × 25mm
    • -060: Rated core operating frequency of 600MHz

      This version is non-lead-free construction, shipped in anti-static tray packaging for PCB surface mount assembly. The component has been officially discontinued by Analog Devices.

    주요 전기적 성능 매개변수

    Computing Core Architecture

    Combines the advantages of RISC, VLIW and traditional DSP architectures, adopting dual independent computing units with SIMD parallel execution capability. Each arithmetic unit is equipped with ALU, hardware multiplier, barrel shifter and dedicated register group, paired with two independent address generators to accelerate circular addressing and bit-reversal addressing operations required for FFT algorithms.

    Supported data formats: 8/16/32/64-bit fixed-point, IEEE 32-bit single-precision floating point, 40-bit extended precision floating point.

    Key performance indicators at 600MHz:

    • Instruction cycle: 1.67ns
    • Peak floating-point throughput: 3.6 GFLOPS
    • 1024-point complex FFT calculation time: only 16.8μs
    • Ultra-high energy efficiency: 1500 MFLOPS per watt

    On-Chip Memory Resources

    Total on-chip embedded DRAM reaches 24Mbit (3MB), divided into multiple independent memory banks that can be freely allocated for program storage and data buffering. Multi-group wide internal buses deliver ultra-high internal access bandwidth, effectively eliminating data transmission bottlenecks during continuous algorithm operation. No built-in non-volatile flash memory; application programs must be loaded from external storage after power initialization.

    통합 주변기기 인터페이스

    1. Four independent high-speed Link Ports: realize seamless glueless interconnection between multiple DSP chips, convenient for building scalable multi-processor parallel computing arrays
    2. 14-channel zero-overhead DMA controller: completes automatic data transmission between internal memory, external SDRAM, peripherals and inter-chip ports without occupying core computing resources
    3. Built-in SDRAM memory controller for expanding large-capacity off-chip storage space
    4. Dual programmable hardware timers, general-purpose flag I/O pins
    5. IEEE 1149.1 standard JTAG debug port for program download, online emulation and system fault diagnosis
    6. Host interface for communication with upper-level main control processors

    전원 공급 장치 사양

    • Core digital supply voltage: 1.2V
    • Digital I/O interface supply voltage: 2.5V

    포장 및 조립 사양

    Encapsulated in 576-ball thermally enhanced BGA surface-mount package with overall dimensions 25mm × 25mm. The large bottom thermal pad significantly improves heat dissipation efficiency under long-term full-load high-speed operation and stabilizes grounding performance for high-speed digital circuits.

    Moisture Sensitivity Level: MSL3. All reflow soldering procedures must be finished within 168 hours after the vacuum sealed package is opened. Anti-static tray packaging is adopted to meet the production requirements of industrial electronic equipment.

    환경 및 규정 준수 기준

    Stable continuous operating temperature range: -40°C ~ +85°C. It can work reliably for a long time in airborne equipment, ground radar stations, medical imaging systems and industrial test instruments with severe temperature changes and strong electromagnetic interference.

    This variant does not adopt lead-free process, not fully compliant with current RoHS environmental directives; the corresponding lead-free model is ADSP-TS201SABPZ-060.

    일반적인 애플리케이션 분야

    Radar echo signal processing, beam forming, target detection and tracking systems

    Medical CT, nuclear magnetic resonance, ultrasonic imaging real-time data computing equipment

    Underwater sonar acoustic signal acquisition, filtering and post-processing systems

    Wireless communication base station broadband signal demodulation, channel equalization and decoding modules

    Aerospace airborne navigation, remote sensing data embedded processing platforms

    High-end spectrum analyzers, vector signal generators and precision electronic measurement instruments