| MODELL P/N | SERIE | ANZAHL DER LABORE/KLINIKEN | GESCHWINDIGKEITSSTUFE | ANZAHL DER LOGIKELEMENTE / ZELLEN | RAM-BITS INSGESAMT | ANZAHL DER E/A | SPANNUNG - VERSORGUNG | BEFESTIGUNGSTYP | BETRIEBSTEMPERATUR | VERPACKUNG / KASSE | LIEFERANT GERÄTEPAKET |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XCVU095-1FFVC1517I | Virtex® UltraScale | 67,20 | -1,00 | 1.176.000 LE | 60,259,200 ~ | 832 | 0,922 V ~ 0,979 V (laut Datenblatt) | Oberflächenmontage | -40 °C ~ +100 °C (I) | 1517-FBGA / FCBGA | 1517-FCBGA (Flip-Chip-Ball-Grid-Array) |
XCVU095-1FFVC1517I
Hersteller: Xilinx
Logische Zellen: 1,143,360
Logische Schnitte: 178,650
Eingebettetes RAM (eRAM): 48.960 Kb (1.360 × 36Kb Block RAM)
Maximale Benutzer-E/A: 520
Paket: FFVC1517 (Flip-Chip BGA)
Geschwindigkeitsstufe: -1
Betriebstemperatur: Industriell (-40°C bis +100°C)
Spezifikationen
Definition der Artikelnummer
This industrial-grade low-power FPGA belongs to the Xilinx Virtex UltraScale family and is fabricated using the 20nm FinFET process. It is equipped with moderate logic, computing and high-speed interface resources, optimized for battery-powered portable field devices, miniature airborne payload modules, outdoor industrial data acquisition equipment and vehicle-mounted embedded systems that demand reliable operation across the full industrial temperature range.
- XCVU095: Mid-entry capacity device in the Virtex UltraScale series, featuring a complete high-speed interconnection architecture and streamlined resource layout
- -1: Speed Grade 1, low-power optimized timing variant. It prioritizes power saving and thermal stability over maximum operating frequency, well-suited for continuously running devices with limited heat dissipation space
- FFVC1517: 1517-ball compact flip-chip FCBGA package. The small footprint enables equipment miniaturization, while adequate pins accommodate the full deployment of on-chip transceivers, general-purpose I/O and peripheral memory circuits
- I: Industrial temperature rating, continuous junction temperature operating range: -40°C ~ +100°C
On-Chip Hardware Resource Parameters
1. Programmable Logic Resources
- Total Logic Cells: 1182000
- Configurable CLB Slices: 67560
- Total Flip-Flops: 1351200
- Total LUT Lookup Tables: 675600
- Distributed RAM Capacity: 9.2 Mb
2. Arithmetic and Embedded Memory Resources
- DSP48E2 arithmetic blocks: 900 units, applicable to fixed-point and floating-point calculations, large-scale FFT computation, radar signal modulation and demodulation, cryptographic algorithm acceleration and small-to-medium matrix operations
- Total Block RAM Capacity: 35.6 Mb, utilized for image frame buffering, deep FIFO data caching, waveform storage and algorithm parameter tables
No UltraRAM memory is integrated within this chip
3. Clock Management Subsystem
- 12 MMCM clock management tiles
- 12 PLL phase-locked loops
Multiple independent clock domains can be flexibly configured to adjust clock phase precisely, compensate signal transmission delay and suppress high-frequency jitter, satisfying stringent timing synchronization requirements of complex digital systems
4. Serielle Hochgeschwindigkeits-Transceiver
- 24 GTH differential high-speed transceivers
Each lane delivers a maximum transmission rate of 32.75 Gbps, compatible with PCIe Gen4, 100G Ethernet, Aurora, JESD204B and other mainstream high-speed serial protocols. Built-in hard Ethernet IP cores simplify the development of high-bandwidth network interfaces
5. I/O Interfaces and System Monitoring Module
- Configurable user I/O pins: 624
Multiple I/O bank voltage domains ranging from 1.2V to 3.3V are supported, fully compatible with LVCMOS, LVDS, HSTL, SSTL and all common single-ended and differential signal standards
The embedded system monitoring module continuously monitors chip junction temperature, internal power supply voltages and external analog input signals in real time
Power Supply Characteristics
The nominal core operating voltage for Speed Grade 1 ranges from 0.92V to 0.98V. Programmable logic, block RAM, DSP arrays and serial transceivers are assigned to separate power domains, supporting partial module power shutdown to dynamically reduce overall power consumption
Typical total power consumption ranges from 10W to 36W. For stable full-load continuous operation at the upper industrial temperature limit, forced air cooling is required
Packaging and SMT Assembly Specifications
- Package form: 1517-pin FCBGA flip-chip ball grid array
- Moisture Sensitivity Level: MSL4. All reflow soldering operations must be finished within 72 hours after vacuum packaging is unsealed
- Lead-free packaging design, fully compliant with RoHS environmental standards
- Chips are stored and shipped in anti-static trays to avoid electrostatic damage during mass PCB assembly
Environmental Adaptability and Reliability
The chip maintains long-term stable operation under drastic temperature swings, mechanical shock, vibration and intense electromagnetic interference. It supports AES bitstream encryption, dynamic partial reconfiguration and SEU single-event upset detection and correction, with enhanced radiation tolerance, making it ideal for miniature aerospace payloads, military portable test terminals and outdoor industrial field deployment
Typische Anwendungsszenarien
- Lightweight UAV payload processing boards and miniature airborne signal preprocessing modules
- Small-sized rugged VPX auxiliary control mainboards for military equipment
- Portable field spectrum analyzers and outdoor arbitrary waveform generators
- Outdoor multi-channel industrial sensor data acquisition and real-time signal processing systems
- Space-constrained small-scale chip prototype verification platforms
- Vehicle-mounted intelligent perception preprocessing units and wide-temperature industrial edge gateways
