XC7Z020-2CLG484I
Hersteller: AMD (Xilinx)
Logische Zellen: 85,000
Logische Schnitte: 13,300
Eingebettetes RAM (eRAM): 4.860 Kb (270 × 18Kb Block RAM)
Paket: CLG484 (CSBGA-484)
Betriebstemperatur: Industriell (-40°C bis +100°C)
Spezifikationen
Erläuterung der Artikelnummer
This is Xilinx Zynq-7000 All Programmable SoC, built on 28nm process, integrating dual-core ARM processor system and Artix-7 programmable logic fabric.
- XC7Z020: Mid-entry Zynq-7000 heterogeneous chip
- -2: Speed Grade 2, high timing margin for stable high-speed design
- CLG484: 484-pin CSPBGA package, dimension 23mm × 23mm
- I: Industrial temperature grade, junction temperature range: -40℃ ~ +100℃
Complete On-Chip Architecture
1. Verarbeitungssystem (PS: ARM-Prozessorsubsystem)
- Dual-core ARM Cortex-A9 processors running up to 766MHz
- Integrated NEON SIMD floating-point arithmetic unit for multimedia and signal calculation acceleration
- On-chip 256KB L2 shared cache + 32KB L1 I/D cache per core
- Rich built-in peripherals: Dual Gigabit Ethernet, USB 2.0 OTG, SD/MMC, CAN, UART, SPI, I2C, GPIO
- Hardware security unit supports secure boot and data encryption
2. Programmable Logic (PL: FPGA Part, Artix-7 based)
- Total Logic Cells: 85,440
- Configurable Logic Slices: 13,300
- DSP48E1 arithmetic blocks: 220 units, for filtering, FFT, sensor data calculation, image preprocessing
- Total Block RAM: 4.9 Mb
- 8 clock management tiles (CMT) with MMCM+PLL for multi-clock domain generation and jitter cleaning
- No built-in high-speed serial transceivers
3. General I/O & Analog Monitoring
- Total usable user I/O pins: 210
- I/O banks support 1.2V/1.5V/1.8V/2.5V/3.3V, compatible with LVCMOS, LVDS differential signals
- On-chip XADC 12-bit dual-channel analog monitor: measures chip temperature, internal power voltages and external analog input signals
Technische Daten zum Netzteil
Independent power domains for processor core, FPGA fabric and I/O banks
Core voltage typical value: 1.0V
Overall typical power consumption: 4W ~ 18W, passive heat sink cooling is available for compact embedded devices
Packaging & Assembly Rules
- Package: 484-ball CSPBGA
- Feuchtigkeitsempfindlichkeitsstufe: MSL3. Das Reflow-Löten muss innerhalb von 168 Stunden nach dem Öffnen der Vakuumverpackung abgeschlossen sein.
- Lead-free packaging, fully RoHS compliant
- Lieferung in antistatischen Trays für die automatisierte Leiterplatten-Massenfertigung
Environmental and Reliability Performance
Stable continuous operation under drastic temperature changes and strong electromagnetic interference.
Supports bitstream encryption, SEU error detection, ideal for industrial control, vehicle-mounted equipment and outdoor embedded terminals requiring long-term stability.
Typische Anwendungsbereiche
- Industrial controllers, servo drive main control boards, industrial gateways
- Embedded machine vision, industrial camera image acquisition and visual inspection equipment
- Portable data recorders, vibration monitoring and multi-channel sensor acquisition terminals
- Medical portable testing equipment main control and signal processing modules
- Intelligent handheld terminals, embedded Linux core development boards
- Small IoT edge computing nodes and serial protocol conversion devices
