XC7Z020-2CLG484I
Nhà sản xuất: AMD (Xilinx)
Tế bào logic: 85,000
Các lát cắt logic: 13,300
Bộ nhớ RAM tích hợp (eRAM): 4,860 Kb (270 × 18Kb Block RAM)
Gói: CLG484 (CSBGA-484)
Nhiệt độ hoạt động: Công nghiệp (-40°C đến +100°C)
Thông số kỹ thuật
Part Number Explanation
This is Xilinx Zynq-7000 All Programmable SoC, built on 28nm process, integrating dual-core ARM processor system and Artix-7 programmable logic fabric.
- XC7Z020: Mid-entry Zynq-7000 heterogeneous chip
- -2: Speed Grade 2, high timing margin for stable high-speed design
- CLG484: 484-pin CSPBGA package, dimension 23mm × 23mm
- I: Industrial temperature grade, junction temperature range: -40℃ ~ +100℃
Complete On-Chip Architecture
1. Processing System (PS: ARM Processor Subsystem)
- Dual-core ARM Cortex-A9 processors running up to 766MHz
- Integrated NEON SIMD floating-point arithmetic unit for multimedia and signal calculation acceleration
- On-chip 256KB L2 shared cache + 32KB L1 I/D cache per core
- Rich built-in peripherals: Dual Gigabit Ethernet, USB 2.0 OTG, SD/MMC, CAN, UART, SPI, I2C, GPIO
- Hardware security unit supports secure boot and data encryption
2. Programmable Logic (PL: FPGA Part, Artix-7 based)
- Total Logic Cells: 85,440
- Configurable Logic Slices: 13,300
- DSP48E1 arithmetic blocks: 220 units, for filtering, FFT, sensor data calculation, image preprocessing
- Total Block RAM: 4.9 Mb
- 8 clock management tiles (CMT) with MMCM+PLL for multi-clock domain generation and jitter cleaning
- No built-in high-speed serial transceivers
3. General I/O & Analog Monitoring
- Total usable user I/O pins: 210
- I/O banks support 1.2V/1.5V/1.8V/2.5V/3.3V, compatible with LVCMOS, LVDS differential signals
- On-chip XADC 12-bit dual-channel analog monitor: measures chip temperature, internal power voltages and external analog input signals
Power Supply Specifications
Independent power domains for processor core, FPGA fabric and I/O banks
Core voltage typical value: 1.0V
Overall typical power consumption: 4W ~ 18W, passive heat sink cooling is available for compact embedded devices
Packaging & Assembly Rules
- Package: 484-ball CSPBGA
- Moisture Sensitivity Level: MSL3. Reflow soldering must be finished within 168 hours after vacuum packaging is opened
- Lead-free packaging, fully RoHS compliant
- Supplied in anti-static trays for automated PCB mass production
Environmental and Reliability Performance
Stable continuous operation under drastic temperature changes and strong electromagnetic interference.
Supports bitstream encryption, SEU error detection, ideal for industrial control, vehicle-mounted equipment and outdoor embedded terminals requiring long-term stability.
Các lĩnh vực ứng dụng điển hình
- Industrial controllers, servo drive main control boards, industrial gateways
- Embedded machine vision, industrial camera image acquisition and visual inspection equipment
- Portable data recorders, vibration monitoring and multi-channel sensor acquisition terminals
- Medical portable testing equipment main control and signal processing modules
- Intelligent handheld terminals, embedded Linux core development boards
- Small IoT edge computing nodes and serial protocol conversion devices
