| MODELL P/N | SERIE | ANZAHL DER LABORE/KLINIKEN | GESCHWINDIGKEITSSTUFE | ANZAHL DER LOGIKELEMENTE / ZELLEN | RAM-BITS INSGESAMT | ANZAHL DER E/A | SPANNUNG - VERSORGUNG | BEFESTIGUNGSTYP | BETRIEBSTEMPERATUR | VERPACKUNG / KASSE | LIEFERANT GERÄTEPAKET |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7K410T-2FBG676E | Kintex-7 | 31.775,00 | -2,00 | 406,720 | 29306880 | 400 | 0.97 ~ 1.03 | Oberflächenmontage | 0 °C ~ 100 °C (E) | 676-FCBGA | 676-FCBGA (27×27) |
XC7K410T-2FBG676E
Hersteller: Xilinx
Logische Zellen: 406,720
Logische Schnitte: 63,550
Eingebettetes RAM (eRAM): 28,800 Kb (800 × 36Kb Block RAM)
Maximale Benutzer-E/A: 400
Paket: FBG676 (Flip-Chip BGA)
Geschwindigkeitsstufe: -2
Betriebstemperatur: Erweitert (0°C bis +100°C)
Spezifikationen
Definition der Artikelnummer
This is a high-density extended industrial temperature FPGA from Xilinx Kintex‑7 family, manufactured with mature 28nm process technology. It features massive logic resources, abundant arithmetic units and ample high-speed interfaces, designed for complex signal processing, multi-channel data acquisition, industrial communication and rugged embedded systems requiring stable operation across wide temperature ranges.
- XC7K410T: High-end large-density model of Kintex‑7 series, T represents low-power optimized variant
- -2: Speed Grade 2, mainstream balanced timing grade. It provides adequate timing margin for most complex high-frequency digital designs, balancing operating frequency, timing closure stability and overall power consumption
- FBG676: 676-ball flip-chip BGA package, rich pin resources support multi-peripheral expansion and multi-channel parallel signal access
- E: Extended industrial temperature grade, operating junction temperature range: -40°C ~ +100°C
On-Chip Hardware Resource Specifications
1. General Logic Resources
- Total Logic Cells: 416,000
- Available Slices: 65,000
- Total Flip‑Flops: 520,000
- Total LUTs: 260,000
2. Arithmetic & Memory Resources
- DSP48E1 arithmetic slices: 1,540 units, applicable to large-scale FFT, digital filtering, radar signal processing, video algorithm calculation and massive matrix computation
- Total Block RAM capacity: 28,620 Kb, used for large data buffering, deep FIFO storage, image frame caching and parameter lookup tables
- Distributed RAM capacity: 7,088 Kb
3. Taktmanagement-Module
- 10 MMCM clock management tiles
- 10 PLL phase locked loops
Supports multi-domain asynchronous clock generation, phase offset adjustment and high-frequency clock jitter suppression to satisfy strict timing requirements of complex multi-module systems
4. Serielle Hochgeschwindigkeits-Transceiver
- 16 GTX high-speed serial transceivers
Maximum line rate up to 10.3125 Gbps, compatible with PCIe Gen2, Aurora, CPRI, 10 Gigabit Ethernet, JESD204B mainstream high-speed serial protocols
5. I/O Interfaces & On-Chip Monitoring Unit
- Configurable user I/O pins: 400
I/O bank voltage adjustable between 1.2V and 3.3V, fully compatible with LVCMOS, LVDS, HSTL, SSTL and all mainstream differential signal standards
Integrated dual-channel 12-bit XADC analog monitor for real-time monitoring of die junction temperature, internal power supply voltages and external analog input signals
Leistungseigenschaften
Nominal core internal supply voltage: 1.0V
Independent isolated power domains are assigned for logic fabric, block RAM, DSP arrays and serial transceivers separately
Typical overall power consumption: 12W ~ 36W; forced air active heat dissipation is required for continuous full-load operation under high-temperature working conditions
Anforderungen an Verpackung und SMT
- Package Type: 676-pin FCBGA flip-chip ball grid array
- Moisture Sensitivity Level: MSL3; all reflow soldering processes must be completed within 168 hours after vacuum packaging is opened
- Lead-free construction, fully compliant with RoHS environmental regulations
- Packaged and shipped in anti-static trays for automated PCB mass production
Umweltverträglichkeit und Zuverlässigkeit
The chip maintains stable continuous operation under wide temperature variation, mechanical vibration and moderate electromagnetic interference harsh industrial environments. It supports AES bitstream encryption and SEU single-event upset error detection, delivering high robustness for field rugged industrial, communication and test measurement equipment.
Typische Anwendungsszenarien
- Multi-channel high-speed data acquisition systems, portable high-end spectrum analyzers and oscilloscopes
- Software-defined radio baseband processing platforms, small cell wireless communication equipment
- Multi-channel industrial vision inspection main control boards, high-speed image processing units
- Industrial high-performance gateway, multi-protocol industrial bus convergence equipment
- Miniature airborne radar signal preprocessing modules, vehicle-mounted high-performance computing units
- Wide-temperature industrial high-performance SOM core boards and complex algorithm prototype verification platforms
