| MODELL P/N | SERIE | ANZAHL DER LABORE/KLINIKEN | GESCHWINDIGKEITSSTUFE | ANZAHL DER LOGIKELEMENTE / ZELLEN | RAM-BITS INSGESAMT | ANZAHL DER E/A | SPANNUNG - VERSORGUNG | BEFESTIGUNGSTYP | BETRIEBSTEMPERATUR | VERPACKUNG / KASSE | LIEFERANT GERÄTEPAKET |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7K410T-2FBG676E | Kintex-7 | 31.775,00 | -2,00 | 406,720 | 29306880 | 400 | 0.97 ~ 1.03 | Oberflächenmontage | 0 °C ~ 100 °C (E) | 676-FCBGA | 676-FCBGA (27×27) |
XC7K410T-2FBG676E
Hersteller: Xilinx
Logische Zellen: 406,720
Logische Schnitte: 63,550
Eingebettetes RAM (eRAM): 28,800 Kb (800 × 36Kb Block RAM)
Maximale Benutzer-E/A: 400
Paket: FBG676 (Flip-Chip BGA)
Geschwindigkeitsstufe: -2
Betriebstemperatur: Erweitert (0°C bis +100°C)
Spezifikationen
Definition der Artikelnummer
This is a high-density extended industrial temperature FPGA from Xilinx Kintex‑7 family, manufactured with mature 28nm process technology. It features massive logic resources, abundant arithmetic units and ample high-speed interfaces, designed for complex signal processing, multi-channel data acquisition, industrial communication and rugged embedded systems requiring stable operation across wide temperature ranges.
- XC7K410T: High-end large-density model of Kintex‑7 series, T represents low-power optimized variant
- -2: Speed Grade 2, mainstream balanced timing grade. It provides adequate timing margin for most complex high-frequency digital designs, balancing operating frequency, timing closure stability and overall power consumption
- FBG676: 676-ball flip-chip BGA package, rich pin resources support multi-peripheral expansion and multi-channel parallel signal access
- E: Extended industrial temperature grade, operating junction temperature range: -40°C ~ +100°C
On-Chip Hardware Resource Specifications
1. General Logic Resources
- Total Logic Cells: 416,000
- Available Slices: 65,000
- Total Flip‑Flops: 520,000
- Total LUTs: 260,000
2. Arithmetic & Memory Resources
- DSP48E1 arithmetic slices: 1,540 units, applicable to large-scale FFT, digital filtering, radar signal processing, video algorithm calculation and massive matrix computation
- Total Block RAM capacity: 28,620 Kb, used for large data buffering, deep FIFO storage, image frame caching and parameter lookup tables
- Distributed RAM capacity: 7,088 Kb
3. Clock Management Modules
- 10 MMCM clock management tiles
- 10 PLL phase locked loops
Supports multi-domain asynchronous clock generation, phase offset adjustment and high-frequency clock jitter suppression to satisfy strict timing requirements of complex multi-module systems
4. Serielle Hochgeschwindigkeits-Transceiver
- 16 GTX high-speed serial transceivers
Maximum line rate up to 10.3125 Gbps, compatible with PCIe Gen2, Aurora, CPRI, 10 Gigabit Ethernet, JESD204B mainstream high-speed serial protocols
5. I/O Interfaces & On-Chip Monitoring Unit
- Configurable user I/O pins: 400
I/O bank voltage adjustable between 1.2V and 3.3V, fully compatible with LVCMOS, LVDS, HSTL, SSTL and all mainstream differential signal standards
Integrated dual-channel 12-bit XADC analog monitor for real-time monitoring of die junction temperature, internal power supply voltages and external analog input signals
Power Characteristics
Nominal core internal supply voltage: 1.0V
Independent isolated power domains are assigned for logic fabric, block RAM, DSP arrays and serial transceivers separately
Typical overall power consumption: 12W ~ 36W; forced air active heat dissipation is required for continuous full-load operation under high-temperature working conditions
Packaging & SMT Requirements
- Package Type: 676-pin FCBGA flip-chip ball grid array
- Moisture Sensitivity Level: MSL3; all reflow soldering processes must be completed within 168 hours after vacuum packaging is opened
- Lead-free construction, fully compliant with RoHS environmental regulations
- Packaged and shipped in anti-static trays for automated PCB mass production
Environmental Adaptability & Reliability
The chip maintains stable continuous operation under wide temperature variation, mechanical vibration and moderate electromagnetic interference harsh industrial environments. It supports AES bitstream encryption and SEU single-event upset error detection, delivering high robustness for field rugged industrial, communication and test measurement equipment.
Typische Anwendungsszenarien
- Multi-channel high-speed data acquisition systems, portable high-end spectrum analyzers and oscilloscopes
- Software-defined radio baseband processing platforms, small cell wireless communication equipment
- Multi-channel industrial vision inspection main control boards, high-speed image processing units
- Industrial high-performance gateway, multi-protocol industrial bus convergence equipment
- Miniature airborne radar signal preprocessing modules, vehicle-mounted high-performance computing units
- Wide-temperature industrial high-performance SOM core boards and complex algorithm prototype verification platforms
