XC7K410T-2FBG676E

Manufacturer: Xilinx
Logic Cells: 406,720
Logic Slices: 63,550
Embedded RAM (eRAM): 28,800 Kb (800 × 36Kb Block RAM)
Maximum User I/O: 400
Package: FBG676 (Flip-Chip BGA)
Speed Grade: -2
Operating Temperature: Extended (0°C to +100°C)

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    Specifications

    MODEL P/N SERIES NUMBER OF LABS/CLBS SPEED GRADE NUMBER OF LOGIC ELEMENTS / CELLS TOTAL RAM BITS NUMBER OF I/O VOLTAGE – SUPPLY MOUNTING TYPE OPERATING TEMPERATURE PACKAGE / CASE SUPPLIER DEVICE PACKAGE
    XC7K410T-2FBG676E Kintex-7 31.775,00 -2,00 406,720 29306880 400 0.97 ~ 1.03 Surface Mount 0 °C ~ 100 °C (E) 676-FCBGA 676-FCBGA (27×27)