XC5VFX70T-2FFG1136I

Hersteller: Xilinx
Logische Zellen: 71,680
Logische Schnitte: ~5,600
Eingebettetes RAM (eRAM): 5,456 Kb
Paket: FFG1136 (Flip?Chip BGA)
Betriebstemperatur: Industriell (-40°C bis +100°C)

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    Spezifikationen

    MODELL P/N SERIE ANZAHL DER LABORE/KLINIKEN GESCHWINDIGKEITSSTUFE ANZAHL DER LOGIKELEMENTE / ZELLEN RAM-BITS INSGESAMT ANZAHL DER E/A SPANNUNG - VERSORGUNG BEFESTIGUNGSTYP BETRIEBSTEMPERATUR VERPACKUNG / KASSE LIEFERANT GERÄTEPAKET
    XC5VFX70T-2FFG1136I Virtex-5 FXT 5.600,00 -2,00 71680 5455872 640 0,95 V-1,05 V Oberflächenmontage -40 °C ~ +100 °C 1136-FBGA / FCBGA 1136-FCBGA (≈31×31 mm)

    XC5VFX70T-2FFG1136I – Xilinx Virtex-5 FXT FPGA

    Die XC5VFX70T-2FFG1136I is a mid-to-high density FPGA from the Xilinx Virtex-5 FXT family, designed for systems that require embedded processing, high-speed serial interfaces, and reliable logic performance in a single device. At LXB Halbleiter, this part is commonly supplied for industrial and communications platforms where architectural stability and long-term support are key selection factors.

    Logic Resources and Embedded Processing

    The XC5VFX70T provides approximately 70K logic cells, offering sufficient capacity for protocol handling, multi-channel data paths, and custom control logic. As part of the FXT family, it integrates dual PowerPC® 440 processors, enabling designers to implement system control, real-time management, and software-driven functions directly within the FPGA.

    Die -2 Geschwindigkeitsstufe supports higher internal operating frequencies and tighter timing margins, making this device suitable for designs with moderate to demanding performance requirements.

    High-Speed Serial Connectivity

    This device integrates RocketIO™ GTX-Transceiver, allowing direct support for high-speed serial standards such as PCI Express, Serial RapidIO, Gigabit Ethernet backplanes, and proprietary point-to-point links. This reduces reliance on external interface devices and helps simplify high-speed board design.

    On-Chip Memory and System Integration

    A practical amount of Block-RAM is available for buffering, data queues, and local memory for the embedded processors. This supports deterministic behavior and reduces external memory bandwidth requirements in real-time systems.

    The Virtex-5 FXT platform is backed by a mature Xilinx toolchain and a well-established IP ecosystem, which remains valuable for long-life products and system maintenance projects.

    Package and Industrial Temperature Grade

    Die FFG1136 flip-chip BGA package provides a high pin count for flexible I/O planning and interface-dense designs.
    Die industrial temperature grade (I) ensures stable operation across extended temperature ranges, making this FPGA suitable for factory automation, outdoor communication equipment, and other harsh-environment applications.

    Typische Anwendungen

    The XC5VFX70T-2FFG1136I is widely used in:

    • Telecommunications and networking equipment

    • Embedded processing platforms with hardware–software co-design

    • Industrial control and automation systems

    • High-speed data acquisition and interface cards

    • Long-life and legacy system support