| 모델 P/N | 시리즈 | 실험실/CLBS 수 | 속도 등급 | 논리 요소/셀 수 | 총 램 비트 | I/O 수 | 전압 - 공급 | 마운팅 유형 | 작동 온도 | 패키지 / 케이스 | 공급업체 디바이스 패키지 |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC5VFX70T-2FFG1136I | Virtex-5 FXT | 5.600,00 | -2,00 | 71680 | 5455872 | 640 | 0.95 V–1.05 V | 표면 실장 | -40 °C ~ +100 °C | 1136-FBGA / FCBGA | 1136-FCBGA (≈31×31 mm) |
XC5VFX70T-2FFG1136I – Xilinx Virtex-5 FXT FPGA
그리고 XC5VFX70T-2FFG1136I is a mid-to-high density FPGA from the Xilinx Virtex-5 FXT family, designed for systems that require embedded processing, high-speed serial interfaces, and reliable logic performance in a single device. At LXB 세미콘, this part is commonly supplied for industrial and communications platforms where architectural stability and long-term support are key selection factors.
Logic Resources and Embedded Processing
The XC5VFX70T provides approximately 70K logic cells, offering sufficient capacity for protocol handling, multi-channel data paths, and custom control logic. As part of the FXT family, it integrates dual PowerPC® 440 processors, enabling designers to implement system control, real-time management, and software-driven functions directly within the FPGA.
그리고 속도 등급 -2 supports higher internal operating frequencies and tighter timing margins, making this device suitable for designs with moderate to demanding performance requirements.
High-Speed Serial Connectivity
This device integrates RocketIO™ GTX 트랜시버, allowing direct support for high-speed serial standards such as PCI Express, Serial RapidIO, Gigabit Ethernet backplanes, and proprietary point-to-point links. This reduces reliance on external interface devices and helps simplify high-speed board design.
On-Chip Memory and System Integration
A practical amount of 블록 RAM is available for buffering, data queues, and local memory for the embedded processors. This supports deterministic behavior and reduces external memory bandwidth requirements in real-time systems.
The Virtex-5 FXT platform is backed by a mature Xilinx toolchain and a well-established IP ecosystem, which remains valuable for long-life products and system maintenance projects.
Package and Industrial Temperature Grade
그리고 FFG1136 flip-chip BGA package provides a high pin count for flexible I/O planning and interface-dense designs.
그리고 industrial temperature grade (I) ensures stable operation across extended temperature ranges, making this FPGA suitable for factory automation, outdoor communication equipment, and other harsh-environment applications.
일반적인 애플리케이션
The XC5VFX70T-2FFG1136I is widely used in:
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Telecommunications and networking equipment
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Embedded processing platforms with hardware–software co-design
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Industrial control and automation systems
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High-speed data acquisition and interface cards
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Long-life and legacy system support
