XC4VLX100-11FFG1148C

Hersteller: Xilinx
Logische Zellen: 110,592
Logische Schnitte: 49,152
Eingebettetes RAM (eRAM): 4.320 Kb (240 × 18Kb Block RAM)
Paket: FFG1148 (Flip?Chip BGA)
Betriebstemperatur: Handelsüblich (0°C bis +85°C)

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    Spezifikationen

    MODELL P/N SERIE ANZAHL DER LABORE/KLINIKEN GESCHWINDIGKEITSSTUFE ANZAHL DER LOGIKELEMENTE / ZELLEN RAM-BITS INSGESAMT ANZAHL DER E/A SPANNUNG - VERSORGUNG BEFESTIGUNGSTYP BETRIEBSTEMPERATUR VERPACKUNG / KASSE LIEFERANT GERÄTEPAKET
    XC4VLX100-11FFG1148C Virtex-4 LX 12.288,00 -11,00 110592 4423680 768 1,14 V-1,26 V Oberflächenmontage 0 °C-+85 °C (C) 1148-BBGA, FCBGA 1148-FCPBGA (35×35)

    XC4VLX100-11FFG1148C: High-Speed Logic Mastery for Commercial System Integration

    Die XC4VLX100-11FFG1148C is the high-performance benchmark of the Virtex®-4 LX family, specifically binned for the -11 Geschwindigkeitsstufe. Utilizing Xilinx’s advanced 90nm ASMBL™ (Advanced Silicon Modular Block) architecture, this device provides a massive 110,592 Logic Cell fabric. It is engineered for designers who require the maximum frequency headroom for logic-heavy designs in commercial-grade applications (0°C to +85°C).

    Untergebracht im FFG1148 Lead-Free Flip-Chip BGA package, it offers an exceptional I/O-to-logic ratio, making it the premier choice for high-bandwidth data bridging, real-time signal processing, and complex system-on-chip (SoC) integration.

    Kerntechnische Highlights

    • Schnellstes logisches Gewebe (-11 Geschwindigkeitsstufe): The premium -11 speed grade provides significantly reduced propagation delays, offering the extra timing slack necessary to achieve closure on 300MHz+ internal clock domains.

    • Massive Logic Consolidation: With over 110k Logic Cells and 12,480 CLBs, the LX100 eliminates the need for multi-FPGA partitioning in most mid-to-high range designs, reducing inter-chip latency and PCB complexity.

    • Erweiterte SelectIO™-Fähigkeit: Die FFG1148 package bricht aus 768 Benutzer-E/As. Leveraging Flip-Chip technology, this package ensures low-inductance paths, providing superior signal integrity for high-speed differential pairs (LVDS/HSTL/SSTL) and wide parallel memory buses (DDR2/QDR-II).

    • XtremeDSP™ Hardware Acceleration: Integrated with 96 dedizierte DSP48-Scheiben. These hard-coded arithmetic blocks allow for high-speed 18×18 multiplications and MAC operations without consuming general-purpose logic resources.

    • Rich Memory Hierarchy: Eigenschaften 4,320 Kb of Block RAM (BRAM), enabling efficient on-chip data buffering, localized caching, and high-speed FIFO implementations required in real-time streaming applications.


    Matrix der technischen Spezifikationen

    Merkmal Spezifikation
    Logische Zellen 110,592
    Konfigurierbare Logikblöcke (CLBs) 12,480
    Block-RAM insgesamt 4.320 Kb
    DSP48-Scheiben 96
    Maximale Benutzer-E/A 768
    Geschwindigkeitsstufe -11 (Hochleistung)
    Betriebstemperatur Handelsüblich (0°C bis +85°C)
    Paket Typ FFG1148 (Lead-Free Flip-Chip BGA)

    Why Specify the LX100-11C?

    1. Reliable Timing in Saturated Designs

    When logic utilization exceeds 75%, routing congestion often kills timing on standard speed grade parts. The -11 Geschwindigkeitsstufe mitigates this “congestion penalty,” ensuring your critical paths meet their frequency targets even when the chip is near capacity.

    2. Superior Power Integrity

    Die FFG1148 package is designed with a dense grid of power and ground pins to suppress Gleichzeitiges Umschaltrauschen (SSN). This is a critical factor for engineers driving nearly 800 I/Os at high toggle rates, ensuring clean signal eyes and robust noise margins.

    3. Proven Toolchain & Longevity

    The Virtex-4 LX100 is a mature, field-proven architecture. For commercial products with long lifecycles—such as high-end medical imaging or professional broadcasting gear—the stability of the 90nm process and its well-documented errata offer a low-risk, high-reliability path to production.


    Anwendungen

    • Professionelles Video: 4K format conversion, real-time encoding/decoding, and high-end switching.

    • Medizinische Systeme: High-speed data acquisition for CT/MRI reconstruction backends.

    • Prüfung und Messung: Logic analyzer front-ends and high-speed automated test equipment (ATE).

    • Telekommunikation: High-speed protocol bridging and localized switching fabrics.