XC4VLX100-11FFG1148C

제조업체: 자일링스
로직 셀: 110,592
로직 슬라이스: 49,152
임베디드 RAM(eRAM): 4,320Kb(240 × 18Kb 블록 RAM)
패키지: FFG1148(플립?칩 BGA)
작동 온도: 상업용(0°C ~ +85°C)

메시지 보내기

    사양

    모델 P/N 시리즈 실험실/CLBS 수 속도 등급 논리 요소/셀 수 총 램 비트 I/O 수 전압 - 공급 마운팅 유형 작동 온도 패키지 / 케이스 공급업체 디바이스 패키지
    XC4VLX100-11FFG1148C Virtex-4 LX 12.288,00 -11,00 110592 4423680 768 1.14V-1.26V 표면 실장 0°C-+85°C(C) 1148-BBGA, FCBGA 1148-FCPBGA(35×35)

    XC4VLX100-11FFG1148C: High-Speed Logic Mastery for Commercial System Integration

    그리고 XC4VLX100-11FFG1148C is the high-performance benchmark of the Virtex®-4 LX family, specifically binned for the -11 속도 등급. Utilizing Xilinx’s advanced 90nm ASMBL™(고급 실리콘 모듈형 블록) 아키텍처를 통해 이 장치는 방대한 110,592 로직 셀 fabric. It is engineered for designers who require the maximum frequency headroom for logic-heavy designs in commercial-grade applications (0°C to +85°C).

    에 보관되어 있습니다. FFG1148 무연 플립칩 BGA package, it offers an exceptional I/O-to-logic ratio, making it the premier choice for high-bandwidth data bridging, real-time signal processing, and complex system-on-chip (SoC) integration.

    핵심 엔지니어링 하이라이트

    • 가장 빠른 로직 패브릭(-11 속도 등급): The premium -11 speed grade provides significantly reduced propagation delays, offering the extra timing slack necessary to achieve closure on 300MHz+ internal clock domains.

    • Massive Logic Consolidation: With over 110k Logic Cells and 12,480 CLBs, the LX100 eliminates the need for multi-FPGA partitioning in most mid-to-high range designs, reducing inter-chip latency and PCB complexity.

    • 고급 SelectIO™ 기능: 그리고 FFG1148 패키지 브레이크 아웃 768 사용자 I/O. Leveraging Flip-Chip technology, this package ensures low-inductance paths, providing superior signal integrity for high-speed differential pairs (LVDS/HSTL/SSTL) and wide parallel memory buses (DDR2/QDR-II).

    • XtremeDSP™ 하드웨어 가속: 다음과 통합 96개의 전용 DSP48 슬라이스. These hard-coded arithmetic blocks allow for high-speed 18×18 multiplications and MAC operations without consuming general-purpose logic resources.

    • 풍부한 메모리 계층 구조: 특징 4,320Kb의 블록 RAM(BRAM), enabling efficient on-chip data buffering, localized caching, and high-speed FIFO implementations required in real-time streaming applications.


    기술 사양 매트릭스

    기능 사양
    논리 셀 110,592
    구성 가능한 로직 블록(CLB) 12,480
    총 블록 RAM 4,320 Kb
    DSP48 슬라이스 96
    최대 사용자 I/O 768
    속도 등급 -11(고성능)
    작동 온도 상업용(0°C ~ +85°C)
    패키지 유형 FFG1148 (Lead-Free Flip-Chip BGA)

    Why Specify the LX100-11C?

    1. Reliable Timing in Saturated Designs

    When logic utilization exceeds 75%, routing congestion often kills timing on standard speed grade parts. The -11 속도 등급 mitigates this “congestion penalty,” ensuring your critical paths meet their frequency targets even when the chip is near capacity.

    2. Superior Power Integrity

    그리고 FFG1148 패키지 is designed with a dense grid of power and ground pins to suppress 동시 스위칭 노이즈(SSN). This is a critical factor for engineers driving nearly 800 I/Os at high toggle rates, ensuring clean signal eyes and robust noise margins.

    3. Proven Toolchain & Longevity

    The Virtex-4 LX100 is a mature, field-proven architecture. For commercial products with long lifecycles—such as high-end medical imaging or professional broadcasting gear—the stability of the 90nm process and its well-documented errata offer a low-risk, high-reliability path to production.


    애플리케이션

    • 전문가용 비디오: 4K format conversion, real-time encoding/decoding, and high-end switching.

    • 의료 시스템: High-speed data acquisition for CT/MRI reconstruction backends.

    • 테스트 및 측정: Logic analyzer front-ends and high-speed automated test equipment (ATE).

    • 통신: High-speed protocol bridging and localized switching fabrics.