Spezifikationen
IS42S16320F-6BLI is a 512Mbit single-data-rate (SDR) synchronous DRAM (SDRAM) manufactured by ISSI (Integrated Silicon Solution Inc.). The suffix BLI stands for industrial temperature grade, tray-packed 54-TFBGA SMD device, optimized for high-density frame buffering, embedded video processing and industrial real-time data caching with high bandwidth and cost efficiency.
👉 It differs from asynchronous SRAM (no refresh required) and low-speed -7/-8 timing variants, as well as TSOP-II through-hole compatible packages. This 6ns fast 167MHz BGA model delivers wider data bus width, higher throughput and smaller PCB footprint, ideal for space-constrained FPGA/ARM embedded systems requiring large volatile buffer storage.
Wesentliche Merkmale
- Memory Architecture & High-Speed Timing
- Total density: 512Mbit, organized as 32M × 16-bit wide data bus
- Rated clock frequency: 167MHz, 6ns CAS latency timing (CL=3)
- Fully synchronous design, all control/address signals sampled on rising clock edge
- 4 independent internal memory banks for interleaved access to mask row precharge latency
- Programmable burst length options: 1, 2, 4, 8 or full-page sequential/interleaved burst mode
- Random column address switching per clock cycle for efficient streaming data accessISSI
- Standard SDRAM Core Functions
- LVTTL-compatible input/output signal levels for direct MCU/FPGA connection
- Dual refresh mechanisms: Auto CBR refresh and low-power self-refresh mode
- Mandatory 8K refresh cycles within 64ms data retention window
- Programmable CAS latency (2 / 3 clock cycles) for flexible timing board design
- Supports burst read-write, burst read-single write and burst stop termination commands
- Electrical & Low-Power Characteristics
- Operating supply voltage VDD/VDDQ: 3.0V ~ 3.6V (nominal 3.3V industrial standard)
- Typical active operating current: ~120mA; ultra-low leakage in self-refresh mode for idle power saving
- Distributed power/ground pins to suppress high-frequency crosstalk noise
- Optimized 0.18µm CMOS process reduces power draw vs older B/D generation silicon
- Package & Industrial Reliability
- Package: 54-ball TF-BGA (8mm × 13mm compact outline), surface mount only for x16 SDRAM
- Temperature grade: Industrial range -40°C ~ +85°C (suffix LI = Industrial)
- MSL 3 moisture sensitivity level (168hrs floor life), lead-free & full RoHS3 compliant
- Tray bulk packaging (suffix I), tape-and-reel TR variant available for mass production lines
Typische Anwendungen
Industrial HMI LCD frame buffer and embedded touch display video memory
FPGA machine vision image line buffer and high-speed pixel data storage
Multichannel high-speed data loggers, oscilloscopes and test measurement instruments
Digital media audio/video decoder buffer for industrial multimedia terminals
Network serial-Ethernet gateway protocol stack packet cache
Medical diagnostic equipment real-time sampling data temporary memory
Smart camera and low-cost industrial vision processing systems
Automotive infotainment dashboard graphics & audio stream buffer
CNC machine tool motion trajectory large data cache
Education FPGA/ARM single-board computer external high-capacity RAM expansion
LXB Semicon supplies original ISSI IS42S16320F-6BLI 512Mbit 167MHz 16-bit SDRAM memory IC
