XC7Z045FFG900I | Xilinx Zynq-7000 High Density Embedded SoC Stock Details, Quotation & Cross Migration Schemes

XC7Z045FFG900I is the high-spec flagship model of Zynq-7000 SoC platform, integrating dual-core Cortex-A9 processor and abundant Artix-7 FPGA logic resources, equipped with massive DSP units and multi-channel high-speed GTX transceivers, industrial temperature grade, FCBGA900 packaging. It is the core chip for medical imaging devices, aerospace signal testers, industrial machine vision equipment and edge embedded computing terminals.
Though AMD guarantees 7-series long-term production, 28nm wafers are occupied by Versal AI chips in large quantities. The factory lead time of XC7Z045 is extended to 30–42 weeks, high-density Zynq models are the scarcest across the whole product lineup.
LXBCHIP reserves more than 2400pcs genuine original sealed tray XC7Z045FFG900I with full serial traceability.

Tiered Price (USD)

1 ~ 12 pcs:

$286.5 / pc

13 ~ 199 pcs: $252.8 / pc

≥ 200 pcs: Negotiable long-term cooperation price

Replacement Chips
  1. Same package upgrade version: XC7Z070FFG900I (richer logic and transceiver resources)
  2. Cost-saving option: XC7Z030FFG900I (for medium-load data acquisition projects)
Applications

Medical CT signal processing board, aerospace communication test module, industrial high-speed data recorder, fiber optic communication gateway controller

Conclusion

High-density Zynq SoCs cannot be stably ordered from official channels in the short term. Our technical team provides free PCB and firmware migration guidance to guarantee your project progress.

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XC7Z045FFG900I | Xilinx Zynq-7000 High-density Embedded SoC Inventory Details, Quotation & Hardware Migration Schemes

XC7Z045FFG900I is the high-spec flagship model of Xilinx Zynq-7000 all-programmable SoC platform, integrating dual-core Cortex-A9 processor and abundant Artix-7 FPGA logic resources, equipped with massive DSP arithmetic units and multi-channel high-speed GTX serial transceivers, industrial temperature grade, FCBGA900 large packaging. It acts as the core control chip for medical imaging equipment, aerospace signal testing terminals, industrial high-precision machine vision systems and edge embedded computing boxes.
Although AMD promises long-term mass production of Zynq-7000 series until 2035, a great quantity of 28nm wafers are occupied by Versal AI chips. The factory lead time of XC7Z045 is extended to 30–42 weeks, and high-density Zynq models are the scarcest products in the entire 7 Series lineup.

LXBCHIP reserves more than 2400 pieces of genuine original sealed tray XC7Z045FFG900I with full serial number traceability.

Tiered Unit Price (USD)

1 ~ 12 pcs:

$286.5 / pc

13 ~ 199 pcs: $252.8 / pc

≥ 200 pcs: Negotiable long-term cooperative price

Optional Replacement Models
  1. Same package pin-compatible upgrade version: XC7Z070FFG900I, richer logic, memory and transceiver resources
  2. Cost-down alternative: XC7Z030FFG900I, suitable for medium-load embedded vision and data acquisition projects

Application Fields

Medical CT signal processing board, aerospace communication signal processing module, industrial high-speed data recorder, optical fiber communication gateway controller

Conclusion

High-density Zynq-7000 SoCs cannot be stably ordered through official channels in the short term. Our technical team provides free PCB and firmware migration guidance to guarantee your project development progress.

XC7K325T-2FFG900I | Xilinx Kintex-7 High-density Industrial FPGA Inventory Update, Quotation & Cross Migration Solutions

XC7K325T-2FFG900I is a high-density mid-to-high-end FPGA of Xilinx Kintex-7 family, rich in logic units, DSP computing resources and multi-channel high-speed GTX transceivers, industrial temperature grade, FCBGA900 large packaging. It is the core chip for high-speed data acquisition equipment, medical CT signal processing boards, aerospace communication testing devices and industrial high-precision vision inspection systems.
Although AMD extends the lifecycle of all 7 Series FPGAs to 2035, 28nm wafer capacity is occupied by Versal AI chips in large quantities. The factory lead time of XC7K325T has been extended to 28–40 weeks, and high-density models are the most scarce in the whole product line.
LXBCHIP reserves more than 2100 pieces of genuine original XC7K325T-2FFG900I sealed tray inventory with full serial number traceability.

Tiered Unit Price (USD)

1 ~ 15 pcs:

$245.6 / pc

16 ~ 199 pcs: $218.2 / pc

≥ 200 pcs: Negotiable long-term cooperative price

Replacement Models

  1. Pin-Compatible Upgrade Version: XC7K410T-2FFG900I, expanded logic and transceiver resources
  2. Cost Reduction Alternative: XC7K160T-2FFG900I, suitable for medium-speed signal processing projects

Application Scenarios

Medical imaging equipment, aerospace signal test module, industrial high-speed data recorder, optical fiber communication gateway

Conclusion

High-density Kintex-7 FPGAs are difficult to obtain through official factory orders. Hardware teams can rely on our spot inventory to ensure project progress. Our technical team provides free PCB and firmware migration guidance.

XC7Z020CLG484I | Xilinx Zynq-7000 SoC Full Spot Inventory, Quotation & Upgrade Alternative Models 2026

Introduction

XC7Z020CLG484I is the most widely used entry-level Zynq-7000 all-programmable SoC, integrating dual-core ARM Cortex-A9 processor and Artix-7 FPGA logic resources, CLG484 BGA package, industrial temperature grade, applied to embedded vision, industrial gateway, intelligent inspection equipment and small-sized edge computing terminals. Although AMD extends Zynq-7000 lifecycle to 2035, 28nm wafer capacity is occupied by Versal AI chips, factory lead time of XC7Z020CLG484I reaches 26–36 weeks, and authorized channels implement strict order quota management. LXBCHIP stores over 3200pcs original sealed tray XC7Z020CLG484I with full serial number traceability, supporting prototype sample supply and long-term annual order locking.

Tiered Unit Price (USD, Brand New Original Tray)

1–14 pcs: $138.7 / pc 15–199 pcs: $119.2 / pc ≥200 pcs: Large order preferential price upon inquiry

Replacement Options

  1. Pin to pin same package upgrade: XC7Z030CLG484I, richer logic and storage resources
  2. Cost reduction option: XC7Z010CLG484I, suitable for lightweight embedded design

Typical Applications

Machine vision recognition module, industrial Ethernet communication gateway, portable medical analysis equipment, robot lower-level motion control board

Conclusion

Zynq-7000 series long lead time problem cannot be solved in short term. Engineering teams can lock spot inventory via LXBCHIP to ensure project progress. Our technical team provides free hardware migration suggestions.

XC7A100T-2CSG324I | Xilinx Artix-7 FPGA Inventory Update, Bulk Pricing & Cross Model Migration Guide

XC7A100T-2CSG324I belongs to AMD Xilinx Artix-7 28nm FPGA product line, with 101,440 logic cells, CSBGA324 compact packaging, industrial temperature grade (-40℃~100℃), built-in multi-channel GTP high-speed serial transceivers and abundant DSP arithmetic units. It is the mainstream cost-effective core chip for machine vision inspection equipment, industrial Ethernet gateways and portable medical testing instruments.

Although AMD has extended the full production and technical support cycle of all Xilinx 7 Series FPGAs to 2035, the limited 28nm wafer capacity is given priority to Versal AI adaptive SoC orders. The factory lead time of XC7A100T-2CSG324I has been extended to 24–32 weeks, and the premium of scattered spot goods in the market exceeds 50% of the official list price. Many small and medium-sized R&D teams are forced to delay prototype progress due to long material waiting cycles.

LXBCHIP reserves more than 2900 pieces of sealed tray original XC7A100T-2CSG324I inventory, with complete serial number traceability and genuine factory packaging without refurbished goods.

Tiered Unit Price (USD, Original Sealed Tray)
  • 1~19 pcs: $142.6 / pc
  • 20~199 pcs: $121.3 / pc
  • ≥200 pcs: Negotiable long-term cooperative price
Compatible Replacement Options
  1. Pin-Compatible Same Package Upgrade: XC7A200T-2CSG324I (expanded logic resources, more transceivers)
  2. Cost Reduction Alternative: XC7A75T-2CSG324I (reduced logic cells, fully compatible with PCB layout)
Typical Application Fields

Industrial machine vision image acquisition board, multi-channel data acquisition recorder, wireless communication signal processing module, medical portable diagnostic equipment