| MODEL P/N | SERIES | NUMBER OF LABS/CLBS | SPEED GRADE | NUMBER OF LOGIC ELEMENTS / CELLS | TOTAL RAM BITS | NUMBER OF I/O | VOLTAGE – SUPPLY | MOUNTING TYPE | OPERATING TEMPERATURE | PACKAGE / CASE | SUPPLIER DEVICE PACKAGE |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XCVU440-1FLGA2892I | Virtex® UltraScale | 0,00 | -1,00 | ~4,432,680 LE (device class) | ~907,264,00 | 1.456 | core/I/O per datasheet | Surface mount | -40 °C ~ +100 °C (I) | 2892-FBGA / FCBGA | 2892-FCBGA (Flip-Chip Ball Grid Array) |
XCVU440-1FLGA2892I
Manufacturer: Xilinx
Logic Cells: 5,520,000
Logic Slices: 862,000
Embedded RAM (eRAM): 118,800 Kb (3,300 × 36Kb Block RAM)
Maximum User I/O: 1,000
Package: FLGA2892 (Flip-Chip BGA)
Speed Grade: -1
Operating Temperature: Industrial (-40°C to +100°C)
Specifications
Part Number Definition
This industrial temperature high-end FPGA belongs to Xilinx Virtex UltraScale series, fabricated with 20nm FinFET process. It integrates ultra-large programmable logic resources, abundant arithmetic units, massive storage modules and numerous high-speed serial ports, oriented to high-performance chip verification, backbone optical communication equipment, aerospace signal processing and rugged industrial computing devices that need reliable operation within the full industrial temperature range.
- XCVU440: High-capacity flagship model of Virtex UltraScale series, equipped with complete high-speed interconnection architecture and maximized logic scale
- -1: Speed Grade 1, low-power focused timing grade. It prioritizes power consumption control and thermal stability rather than peak operating frequency, suitable for long-running devices with limited heat dissipation conditions
- FLGA2892: 2892-ball flip-chip FCBGA large package. Sufficient pins support massive parallel signal access, layout of all high-speed transceivers and multi-channel memory interface connection
- I: Industrial temperature specification, junction temperature working range: -40°C ~ +100°C
On-Chip Hardware Resource Details
1. Programmable Logic Resources
- Total Logic Cells: 5540850
- Configurable CLB Slices: 316620
- Total Flip-Flops: 6332400
- Total LUTs: 3166200
2. Arithmetic and Memory Resources
- DSP48E2 computing units: 2880 pieces, applicable to fixed and floating-point operation, large-scale FFT calculation, radar signal modulation and demodulation, encryption algorithm acceleration and massive matrix computation
- Block RAM total capacity: 88.6 Mb, used for large image frame caching, high-depth data FIFO, waveform storage and algorithm parameter tables
- Distributed RAM capacity: 28.7 Mb, applied to on-chip small cache and lightweight asynchronous data buffering
3. Clock Management Modules
- 24 MMCM clock management units
- 24 PLL phase-locked loops
It can build multiple independent clock domains, adjust clock phase accurately, compensate signal delay and suppress clock jitter, meeting strict timing synchronization demands of ultra-large complex digital systems
4. High-Speed Serial Transceivers
- 48 GTH high-speed differential transceivers
Single lane maximum transmission rate reaches 32.75 Gbps, compatible with PCIe Gen4, 100G/400G Ethernet, Aurora, JESD204B and various optical communication mainstream protocols. Built-in 100G Ethernet hard MAC accelerates high-bandwidth network interface development
5. I/O and System Monitoring Function
- Available configurable user I/O pins: 1504
Multiple voltage domains for I/O banks cover 1.2V to 3.3V, fully compatible with LVCMOS, LVDS, HSTL, SSTL and all common single-ended and differential signal standards
The built-in system monitoring module continuously collects chip junction temperature, internal power supply voltage values and external analog input signals in real time
Power Supply Parameters
Core operating voltage ranges from 0.85V to 0.9V. Logic area, memory modules, DSP units and transceivers adopt mutually independent power domains, supporting partial power-off to flexibly reduce overall power consumption
Typical total power consumption: 35W ~ 85W. For stable full-load operation under the upper limit of industrial temperature, forced air cooling or liquid cooling system is essential
Packaging and SMT Requirements
- Package form: 2892-pin FCBGA flip-chip ball grid array, overall size 55mm × 55mm
- Moisture sensitivity level: MSL4. Reflow soldering must be finished within 72 hours after opening the vacuum package
- Lead-free packaging design, compliant with RoHS environmental standards
- Products are stored and transported in anti-static trays to avoid electrostatic damage during mass PCB production
Environmental Adaptability and Reliability
The chip can run stably for a long time under dramatic temperature changes, mechanical shock, vibration and intense electromagnetic interference. It supports AES bitstream encryption, dynamic partial reconfiguration, SEU error detection and correction, with enhanced anti-radiation performance, fitting aerospace, military and other harsh field deployment scenarios
Main Application Scenarios
- Large-scale ASIC and SoC prototype verification, digital logic emulation platforms
- Core processing boards for backbone 100G/400G optical communication switches
- Airborne radar signal preprocessing equipment, aerospace onboard data computing units
- High-precision signal analyzers, ultra-wideband spectrum testing instruments
- Military rugged VPX high-end embedded mainboards
- High-speed data interconnection equipment and large-scale cryptographic acceleration servers
