XCKU5P-2FFVB676E

Manufacturer: AMD / Xilinx
Logic Cells: 2,540,000
Logic Slices: 158,000
Embedded RAM (eRAM): 190,000 Kb
Package: FFVB676 (Flip-Chip BGA)
Operating Temperature: Extended (0°C to +85°C TJ)

SEND US A MESSAGE

    Specifications

    MODEL P/N SERIES NUMBER OF LABS/CLBS SPEED GRADE NUMBER OF LOGIC ELEMENTS / CELLS TOTAL RAM BITS NUMBER OF I/O VOLTAGE – SUPPLY MOUNTING TYPE OPERATING TEMPERATURE PACKAGE / CASE SUPPLIER DEVICE PACKAGE
    XCKU5P-2FFVB676E Kintex UltraScale+ 27,12 -2,00 474,600 LE 41.98 Mbit 280 0.825V ~ 0.876V Surface Mount 0 °C ~ 100 °C 676-BBGA / FCBGA 676-FCBGA (27×27)