| MODEL P/N | SERIES | NUMBER OF LABS/CLBS | SPEED GRADE | NUMBER OF LOGIC ELEMENTS / CELLS | TOTAL RAM BITS | NUMBER OF I/O | VOLTAGE – SUPPLY | MOUNTING TYPE | OPERATING TEMPERATURE | PACKAGE / CASE | SUPPLIER DEVICE PACKAGE |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XCKU3P-2FFVB676E | Kintex® UltraScale+ | 20,34 | -2,00 | 355,950 LE | 31,641,600 bits | 280 | 0.825–0.876 V | Surface Mount | 0 °C – 100 °C | FCBGA-676 | 676-FCBGA (27×27) |
XCKU3P-2FFVB676E
Manufacturer: AMD / Xilinx
Logic Cells: 1,326,480
Logic Slices: 20,900+
Embedded RAM (eRAM): 75,000+ Kb
Package: FFVB676 (Flip-Chip BGA)
Operating Temperature: Extended (0°C to +85°C TJ)
