| MODEL P/N | SERIES | NUMBER OF LABS/CLBS | SPEED GRADE | NUMBER OF LOGIC ELEMENTS / CELLS | TOTAL RAM BITS | NUMBER OF I/O | VOLTAGE – SUPPLY | MOUNTING TYPE | OPERATING TEMPERATURE | PACKAGE / CASE | SUPPLIER DEVICE PACKAGE |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XCKU3P-1FFVB676I | Kintex® UltraScale+ | 20,34 | -1,00 | 355,950 LE | 31,641,600 bits | 280 | 0.825 V – 0.876 V | Surface Mount | -40 °C – 100 °C | FCBGA-676 | 676-FCBGA (27×27) |
XCKU3P-1FFVB676I
Manufacturer: AMD / Xilinx
Logic Cells: 1,326,480
Logic Slices: 20,900
Embedded RAM (eRAM): 75,000+ Kb
Package: FFVB676 (Flip-Chip BGA)
Operating Temperature: Industrial (-40°C to +100°C TJ)
