XC7Z045-2FBG676I

Manufacturer: AMD / Xilinx
Logic Cells: 350,000
Logic Slices: 54,650
Embedded RAM (eRAM): 19,200 Kb (б╓ 534 × 36Kb Block RAM)
Package: FBG676 (Flip-Chip BGA)
Operating Temperature: Industrial (-40°C to +100°C TJ)

SEND US A MESSAGE

    Specifications

    MODEL P/N SERIES NUMBER OF LABS/CLBS SPEED GRADE NUMBER OF LOGIC ELEMENTS / CELLS TOTAL RAM BITS NUMBER OF I/O VOLTAGE – SUPPLY MOUNTING TYPE OPERATING TEMPERATURE PACKAGE / CASE SUPPLIER DEVICE PACKAGE
    XC7Z045-2FBG676I Zynq-7000 SoC 27,33 -2,00 ~350,000 LE 19200000 250 1.0 V SMD/SMT Industrial (-40 °C … 100 °C) FCBGA-676 FCBGA-676