XC7Z045-1FFG900C

Manufacturer: AMD / Xilinx
Logic Cells: 350,000
Logic Slices: 54,650
Embedded RAM (eRAM): 19,200 Kb (б╓ 534 × 36Kb Block RAM)
Package: FFG900 (Flip-Chip BGA)
Operating Temperature: Commercial (0°C to +85°C TJ)

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    Specifications

    MODEL P/NSERIESNUMBER OF LABS/CLBSSPEED GRADENUMBER OF LOGIC ELEMENTS / CELLSTOTAL RAM BITSNUMBER OF I/OVOLTAGE – SUPPLYMOUNTING TYPEOPERATING TEMPERATUREPACKAGE / CASESUPPLIER DEVICE PACKAGE
    XC7Z045-1FFG900CZynq-7000 SoC27.325,00-1,00350,00020090880340~1.0 VSurface mount0 °C ~ +85 °CFCBGA-900900-FCBGA (31×31 mm)