XC7Z035-3FFG676E

Manufacturer: AMD / Xilinx
Logic Cells: 276,480
Logic Slices: 43,200
Embedded RAM (eRAM): 17,664 Kb (984 × 18Kb Block RAM)
Package: FFG676 (Flip-Chip BGA)
Operating Temperature: Extended (-40°C to +100°C TJ)

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    Specifications

    MODEL P/NSERIESNUMBER OF LABS/CLBSSPEED GRADENUMBER OF LOGIC ELEMENTS / CELLSTOTAL RAM BITSNUMBER OF I/OVOLTAGE – SUPPLYMOUNTING TYPEOPERATING TEMPERATUREPACKAGE / CASESUPPLIER DEVICE PACKAGE
    XC7Z035-3FFG676EZynq-7000 SoC42,98-3,00275,000 LE1760000001.0 VSMD/SMTExtended (0 °C … 100 °C)FCBGA-676FCBGA-676