XC7Z030-L2FFG676I

Manufacturer: Xilinx
Logic Cells: 125,000
Logic Slices: 17,600
Embedded RAM (eRAM): 9,360 Kb (260 × 36Kb Block RAM)
Package: FFG676 (Flip-Chip BGA)
Operating Temperature: Industrial (-40°C to +100°C)

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    Specifications

    MODEL P/N SERIES NUMBER OF LABS/CLBS SPEED GRADE NUMBER OF LOGIC ELEMENTS / CELLS TOTAL RAM BITS NUMBER OF I/O VOLTAGE – SUPPLY MOUNTING TYPE OPERATING TEMPERATURE PACKAGE / CASE SUPPLIER DEVICE PACKAGE
    XC7Z030-L2FFG676I Zynq-7000 SoC 9.825,00 -2,00 125,000 9,768,960 228 ~0.95–1.0 V (L2 low-power) Surface mount −40 °C ~ +100 °C FCBGA-676 676-FCBGA (27×27 mm)