XC7Z030-3FFG676E

Manufacturer: Xilinx
Logic Cells: 125,000
Logic Slices: 17,600
Embedded RAM (eRAM): 9,360 Kb (260 × 36Kb Block RAM)
Package: FFG676 (Flip-Chip BGA)
Operating Temperature: Extended (-40°C to +125°C)

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    Specifications

    MODEL P/N SERIES NUMBER OF LABS/CLBS SPEED GRADE NUMBER OF LOGIC ELEMENTS / CELLS TOTAL RAM BITS NUMBER OF I/O VOLTAGE – SUPPLY MOUNTING TYPE OPERATING TEMPERATURE PACKAGE / CASE SUPPLIER DEVICE PACKAGE
    XC7Z030-3FFG676E Zynq-7000 SoC 19,65 -3,00 ~125,000 LE 9300000 250 1.0 V SMD/SMT Extended (0 °C … 100 °C) FCBGA-676 FCBGA-676