XC7Z030-3FFG676E

Manufacturer: Xilinx
Logic Cells: 125,000
Logic Slices: 17,600
Embedded RAM (eRAM): 9,360 Kb (260 × 36Kb Block RAM)
Package: FFG676 (Flip-Chip BGA)
Operating Temperature: Extended (-40°C to +125°C)

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    Specifications

    MODEL P/NSERIESNUMBER OF LABS/CLBSSPEED GRADENUMBER OF LOGIC ELEMENTS / CELLSTOTAL RAM BITSNUMBER OF I/OVOLTAGE – SUPPLYMOUNTING TYPEOPERATING TEMPERATUREPACKAGE / CASESUPPLIER DEVICE PACKAGE
    XC7Z030-3FFG676EZynq-7000 SoC19,65-3,00~125,000 LE93000002501.0 VSMD/SMTExtended (0 °C … 100 °C)FCBGA-676FCBGA-676