| MODEL P/N | SERIES | NUMBER OF LABS/CLBS | SPEED GRADE | NUMBER OF LOGIC ELEMENTS / CELLS | TOTAL RAM BITS | NUMBER OF I/O | VOLTAGE – SUPPLY | MOUNTING TYPE | OPERATING TEMPERATURE | PACKAGE / CASE | SUPPLIER DEVICE PACKAGE |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7Z030-1FFG676I | Zynq-7000 SoC | 19,65 | -1,00 | ~125,000 LE | 9300000 | 250 | 1.0 V | SMD/SMT | -40 °C ~ 100 °C | FCBGA-676 | FCBGA-676 |
XC7Z030-1FFG676I
Manufacturer: Xilinx
Logic Cells: 125,000
Logic Slices: 17,600
Embedded RAM (eRAM): 9,360 Kb (260 × 36Kb Block RAM)
Package: FFG676 (Flip-Chip BGA)
Operating Temperature: Industrial (-40°C to +100°C)
