XC7K70T-2FBG676I

Manufacturer: Xilinx
Logic Cells: 74,880
Logic Slices: 11,700
Embedded RAM (eRAM): 4,860 Kb (135 × 36Kb Block RAM)
Package: FBG676 (Flip-Chip BGA)
Operating Temperature: Industrial (-40°C to +100°C)

SEND US A MESSAGE

    Specifications

    MODEL P/NSERIESNUMBER OF LABS/CLBSSPEED GRADENUMBER OF LOGIC ELEMENTS / CELLSTOTAL RAM BITSNUMBER OF I/OVOLTAGE – SUPPLYMOUNTING TYPEOPERATING TEMPERATUREPACKAGE / CASESUPPLIER DEVICE PACKAGE
    XC7K70T-2FBG676IKintex-75.125,00-2,0065,60049766403000.97 – 1.03 V (typ 1.0 V)Surface mount−40 °C — 100 °CFBG-676 (27×27 mm)676-FCBGA