XC6VSX315T-1FFG1156I

Manufacturer: Xilinx
Logic Cells: 315,000
Logic Slices: 52,800
Embedded RAM (eRAM): 12,288 Kb
Package: FFG1156 (Flip-Chip BGA)
Operating Temperature: Industrial (-40°C to +100°C)

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    Datasheet

    Specifications

    MODEL P/NSERIESNUMBER OF LABS/CLBSSPEED GRADENUMBER OF LOGIC ELEMENTS / CELLSTOTAL RAM BITSNUMBER OF I/OVOLTAGE – SUPPLYMOUNTING TYPEOPERATING TEMPERATUREPACKAGE / CASESUPPLIER DEVICE PACKAGE
    XC6VSX315T-1FFG1156IVirtex-6 SXT24.600,00-1,00314,880304336646000.95–1.05 VSurface Mount-40 °C ~ 100 °C (TJ)1156-BBGA, FCBGA1156-FCBGA

    XC6VSX315T-1FFG1156I Xilinx Virtex®-6 SXT FPGA

    Next-Gen Performance: The Virtex-6 family offers a 40nm process for lower power consumption and higher density compared to Virtex-5.

    SpecificationDetails
    Logic Cells314,880
    DSP Slices2,016 (High-Performance DSP)
    Memory (BRAM)25,344 Kb
    Operating Temp-40°C ~ 100°C (Industrial)
    Package1156-pin FCBGA

    Optimized for DSP-Intensive Tasks

    The XC6VSX315T-1FFG1156I is specifically designed for high-performance Digital Signal Processing (DSP), making it ideal for radar, medical imaging, and advanced communications.

    Procurement & Availability

    We provide original, new-in-box XC6VSX315T-1FFG1156I with full traceability. Fast global shipping via DHL/FedEx/UPS.

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