XC5VLX155-1FFG1153I

Manufacturer: Xilinx
Logic Cells: 155,520
Logic Slices: 24,960
Embedded RAM (eRAM): 5,760 Kb
Package: FFG1153 (Flip-Chip BGA)
Operating Temperature: Industrial (-40°C to +100°C)

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    Specifications

    MODEL P/NSERIESNUMBER OF LABS/CLBSSPEED GRADENUMBER OF LOGIC ELEMENTS / CELLSTOTAL RAM BITSNUMBER OF I/OVOLTAGE – SUPPLYMOUNTING TYPEOPERATING TEMPERATUREPACKAGE / CASESUPPLIER DEVICE PACKAGE
    XC5VLX155-1FFG1153IVirtex-5 LX12.160,00-1,0015564870778888000.95 V – 1.05 VSurface Mount-40 °C – +100 °C (I)1153-BBGA / FCBGA1153-FCBGA (≈35 × 35 mm)

    The XC5VLX155-1FFG1153I sits between mid-range and high-density devices in the Virtex-5 lineup from Xilinx, offering a strong balance of logic resources and industrial reliability.

    Key Features

    • Industrial temperature range

    • High logic density for complex designs

    • FFG1153 package

    • Integrated DSP and memory blocks

    Applications

    • Industrial automation

    • Data acquisition systems

    • Embedded processing platforms

    Engineering Note

    This model is often used when XC5VLX110 is not sufficient, but XC5VLX330 would be overkill in both cost and power.