XC5VFX130T-2FFG1738C

Manufacturer: Xilinx Logic Cells: 130,560 Logic Slices: 20,480 Embedded RAM (eRAM): 6,048 Kb (336 × 18Kb Block RAM) Package: FFG1738 (Flip-Chip BGA) Operating Temperature: Commercial (0°C to +85°C)

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    Specifications

    MODEL P/NSERIESNUMBER OF LABS/CLBSSPEED GRADENUMBER OF LOGIC ELEMENTS / CELLSTOTAL RAM BITSNUMBER OF I/OVOLTAGE – SUPPLYMOUNTING TYPEOPERATING TEMPERATUREPACKAGE / CASESUPPLIER DEVICE PACKAGE
    XC5VFX130T-2FFG1738CVirtex-5 FXT10.240,00-2,00131072109854728400.95 V–1.05 VSurface Mount0 °C ~ +85 °C1738-FBGA, FCBGA1738-FCPBGA (42.5×42.5 mm)

    Xilinx XC5VFX130T-1FFG1738C | Virtex-5 FXT High-Density Embedded System FPGA

    The XC5VFX100T-1FFG1738C (Correction: XC5VFX130T-1FFG1738C) represents the upper echelon of Xilinx’s Virtex-5 FXT platform. This device is a powerhouse designed for ultra-complex embedded systems, combining massive logic resources with dual PowerPC® 440 processor blocks and high-speed GTX transceivers. With 1738 pins, it provides the maximum I/O density required for large-scale backplane and networking applications.

    At LXB Semicon, we specialize in high-value, high-density Xilinx silicon, providing fully verified XC5VFX130T-1FFG1738C units for global infrastructure, defense, and research projects.

    Comprehensive Technical Specifications

    The “FX130T” is the second-largest member of the FXT family, offering a massive leap in processing capability:

    FeatureDetailed Specification
    Logic Cells131,072
    Embedded Processors2 x PowerPC® 440 Cores (up to 550 MHz each)
    RocketIO™ GTX20 Transceivers (supporting up to 6.5 Gbps)
    DSP48E Slices320
    Total Block RAM10,728 Kb
    Maximum User I/O840
    PackageFFG1738 (Large Flip-Chip BGA, Lead-Free)
    Speed Grade-1 (Standard Performance)

    Why the XC5VFX130T is the Industry Standard for High-End Systems

    For engineers managing complex data-plane and control-plane tasks, the XC5VFX130T-1FFG1738C offers several architectural advantages:

    1. Dual-Processor Efficiency

    Unlike smaller models, the FX130T features dual PowerPC 440 hard cores. This allows for asymmetrical multiprocessing (AMP) where one core can handle a real-time OS (RTOS) while the other manages network stacks or high-level applications, all within a single chip.

    2. Unrivaled I/O & Connectivity

    With 840 user I/Os and 20 GTX transceivers, this FPGA can manage massive parallel data streams and serial protocols (PCIe Gen 2, Serial RapidIO, 10GbE) simultaneously, making it the ideal “brain” for core network routers.

    3. Massive Logic & Memory

    With over 130k logic cells and nearly 11MB of Block RAM, it supports the implementation of high-resolution video pipelines, complex encryption algorithms, and large-scale buffering without the need for excessive external memory.

    4. Thermal & Signal Integrity

    The 1738-pin BGA package is engineered for superior heat dissipation and signal grounding, ensuring stable performance even when the FPGA is running at high utilization rates in commercial temperature environments.

    LXB Semicon: Your Trusted Source for Premium Xilinx Silicon

    Sourcing a complex, high-pin-count FPGA like the XC5VFX130T-1FFG1738C requires a distributor with advanced quality control capabilities. LXB Semicon guarantees:

    • 100% Originality: Every unit is guaranteed to be genuine Xilinx/AMD silicon, sourced from verified channels.

    • Precision Inspection: Given the 1738-pin count, we utilize high-resolution optical inspection to ensure BGA ball integrity and package flatness.

    • ESD & MSL Compliance: Parts are handled in strict accordance with JEDEC standards, vacuum-sealed with desiccant to ensure they are ready for your reflow process.

    • Global Logistics & Support: We provide fast, insured shipping and full technical documentation support for your procurement and engineering teams.


    Frequently Asked Questions (FAQ)

    Q: Is the XC5VFX130T-1FFG1738C supported by Vivado? A: No. Like all Virtex-5 devices, this model requires Xilinx ISE® Design Suite (14.7). It is not compatible with the newer Vivado software.

    Q: What is the benefit of the FFG1738 package over smaller packages? A: The 1738-pin package provides the maximum number of user I/Os (840) and the most GTX transceivers (20) available for this logic density, facilitating massive parallel-to-serial data conversion.

    Q: How does LXB Semicon ensure the quality of high-value FPGAs? A: We use a multi-step verification process including visual inspection under magnification, marking permanency tests, and verification of factory-sealed packaging.


    Get a Quote from LXB Semicon Today Looking for immediate availability or volume pricing for the XC5VFX130T-1FFG1738C? Reach out to our expert sales team.