ICM-20948

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    Specifications

    ICM-20948 is a ultra-low-power 9-axis MotionTracking MEMS IMU developed by TDK InvenSense, integrating 3-axis accelerometer, 3-axis gyroscope, 3-axis magnetometer and built-in Digital Motion Processor (DMP) inside a single compact multi-chip module. It delivers only 1/3 power consumption compared to traditional 9-axis combo sensors, optimized for battery-powered wearable, mobile and IoT motion capture systemsTDK InvenSense.
    👉 It differs from 6-axis BMI160 without geomagnetic sensor and older MPU-9250 with higher power draw. The embedded DMP runs motion fusion algorithm autonomously to reduce MCU computation load, making it ideal for long-battery-life devices requiring heading, tilt and gesture detection.

    Key Features

    1. Complete 9-Axis High-Resolution Sensing Core
    • 3-axis Accelerometer: Programmable FSR ±2g / ±4g / ±8g / ±16g, 16-bit ADC output
    • 3-axis Gyroscope: Configurable range ±250 / ±500 / ±1000 / ±2000 °/s for fast motion tracking
    • 3-axis Magnetometer (AK09916 core): Full-scale ±4900µT for accurate compass heading
    • All sensor channels synchronized with on-chip timestamp to eliminate fusion timing error
    • Embedded digital temperature sensor for thermal drift compensation
    1. Built-In DMP Motion Processor (Core Advantage)
    • On-chip hardware DMP executes motion fusion, quaternion calculation, step counting and gesture detection without host MCU intervention
    • Supports Android-compliant EIS video stabilization and external FSYNC camera frame synchronization
    • Stores motion output data in internal FIFO buffer to cut MCU polling frequency and power loss
    1. Ultra-Low Power Architecture
    • Total active power consumption as low as 2.5mW, far lower than legacy 9-axis sensors
    • Multiple configurable low-power sleep modes for always-on step/tilt wake-up monitoring
    • Wide operating voltage: VDD 1.71V ~ 3.6V; VDDIO limited 1.71V ~ 1.95V for low-voltage battery circuits
    1. Flexible Multi-Protocol Communication
    • Dual main interfaces: 400kHz Fast-Mode I²C or up to 7MHz high-speed SPI
    • Auxiliary I²C bus to expand external pressure, temperature or other peripheral sensors
    • Programmable hardware interrupt pin for motion trigger events (tap, free-fall, activity wake)
    • On-chip programmable digital low-pass filters to suppress mechanical vibration noise
    1. Package & Environmental Specifications
    • Package: 24-pin ultra-small QFN, dimension 3.0 × 3.0 × 1.0mm for miniaturized PCB layout
    • Operating temperature range: -40°C ~ +85°C
    • Wafer-level hermetically sealed MEMS die for shock and humidity resistance
    • Fully RoHS green compliant, tape-and-reel packaging available for mass SMT assembly
    • Note: NRND (Not Recommended for New Designs) due to discontinued magnetometer die supply, only for maintenance stock projects

    Typical Applications

    Smartwatches, fitness bracelets and wearable health activity trackers

    Smartphones, tablets AR/VR head tracking and camera EIS stabilization

    Wireless Bluetooth earbuds gesture control and motion wake-up

    Portable IoT environmental data loggers with tilt/vibration monitoring

    Small drone, mini robot attitude and heading navigation system

    Handheld game controllers, air mouse and interactive remote devices

    Indoor pedestrian dead reckoning positioning modules

    Portable test & measurement instrument tilt and vibration recording

    Smart home wireless sensors, smart lock motion trigger detection

    Educational embedded development boards and maker motion sensing projects

    LXB Semicon supplies original TDK InvenSense ICM-20948 low-power 9-axis MEMS IMU sensor IC