| MODEL P/N | SERIES | NUMBER OF LABS/CLBS | SPEED GRADE | NUMBER OF LOGIC ELEMENTS / CELLS | TOTAL RAM BITS | NUMBER OF I/O | VOLTAGE – SUPPLY | MOUNTING TYPE | OPERATING TEMPERATURE | PACKAGE / CASE | SUPPLIER DEVICE PACKAGE |
|---|---|---|---|---|---|---|---|---|---|---|---|
| ADSP-21469BBCZ-3 | ADSP-21469 (SHARC family) | 0,00 | 400,00 | N/A | 500000 | 0 | Core/IO rails per datasheet | Surface mount | −40 °C to +85 °C | 324-ball CSP / 324-BGA | BC-324-1 (324-Ball CSP_BGA) |
ADSP-21469BBCZ-3
Manufacturer: Analog Devices
Logic Cells: бк
Logic Slices: бк
Embedded RAM (eRAM): 5 Mbits On-Chip SRAM
Package: SABP
Operating Temperature: ?40°C to +85°C
Specifications
Part Number Definition
ADSP-21469 is a fourth-generation SHARC floating-point digital signal processor built on Super Harvard Architecture, optimized for multi-channel audio processing and high-precision real-time signal computation.
BBCZ stands for industrial temperature grade, lead-free construction and 324-ball CSPBGA package measuring 19mm × 19mm. The suffix digit 3 denotes a rated core operating frequency of 400 MHz. The component is delivered in anti-static tray packaging for automated surface-mount PCB assembly.
Core Electrical Performance Parameters
Computing Core Features
- Core operating frequency: 400 MHz, supports SIMD parallel instruction execution to boost arithmetic throughput
- Arithmetic capability: 32-bit single-precision floating point, 40-bit extended precision floating point, together with 8/16/32-bit fixed-point calculation
- Integrated dedicated hardware accelerators for FFT transformation, FIR and IIR digital filtering, which greatly shortens the execution cycle of common signal algorithms
- Full source code compatibility with all legacy SHARC family DSP chips, facilitating program migration and iterative upgrading
On-Chip Memory Resources
Total embedded high-speed SRAM reaches 5 Mbits, which can be flexibly allocated as program storage space and data buffer space. Multi-group independent internal buses eliminate internal data transmission bottlenecks and ensure continuous streaming data processing performance.
Integrated Peripheral Interfaces
- DAI configurable digital audio interface: supports I2S, TDM, SPDIF audio protocols and built-in 8-channel asynchronous sample rate converters
- 8 SPORT synchronous serial ports for direct connection with audio codec chips
- Two high-speed Link Ports, available for multi-DSP cascading and point-to-point large-volume data transmission
- Dual SPI buses, 1 UART, I2C bus, 16-channel PWM outputs and three programmable hardware timers
- Embedded 16-bit DDR2 external memory controller for expanding large-capacity off-chip data memory
- Advanced multi-channel DMA controller with scatter-gather and delay-line DMA functions, handling background data transmission without occupying core computing resources
- Standard IEEE 1149.1 JTAG debug port for program downloading, online debugging and system fault diagnosis
Power Supply Specifications
- Core digital operating voltage: 1.05 V (nominal range 1.0 V ~ 1.1 V)
- Analog circuit and digital I/O voltage: 3.3 V
- No built-in non-volatile flash memory; application firmware must be loaded from external storage devices after power-on initialization
Packaging and Assembly Specifications
Encapsulated in compact 324-pin CSPBGA surface-mount package with overall dimensions 19 mm × 19 mm. The miniature outline is suitable for professional audio equipment, portable precision measuring instruments and embedded control mainboards with limited internal layout space.
Moisture Sensitivity Level is MSL3. All reflow soldering procedures must be completed within 168 hours once the vacuum packaging seal is broken. Anti-static tray packaging is adopted to meet the demands of large-scale industrial electronic production.
Environmental and Compliance Standards
Stable continuous operation is maintained across the industrial temperature range of -40°C to +85°C, adapting to indoor audio devices, medical diagnostic equipment, field monitoring instruments and automation control systems under variable ambient temperature and electromagnetic interference conditions.
Manufactured via full lead-free semiconductor processes, the device complies with global RoHS environmental directives and remains in continuous official production supply.
Typical Application Fields
Professional audio mixing consoles, multi-channel digital audio effects processing systems
Medical ultrasound diagnostic equipment real-time acoustic and image signal calculation modules
Acoustic analyzers, audio testing instruments and vibration noise fault diagnosis devices
Industrial embedded multi-channel signal acquisition and real-time spectrum analysis units
Vehicle-mounted multi-channel audio processing systems and public broadcasting digital matrix equipment
