| الطراز P/N | السلسلة | عدد المعامل/المختبرات | درجة السرعة | عدد العناصر/الخلايا المنطقية | إجمالي بتات ذاكرة الوصول العشوائي (RAM) | عدد الإدخال/الإخراج | الجهد - الإمداد | نوع التركيب | درجة حرارة التشغيل | العبوة / العلبة | حزمة جهاز المورد |
|---|---|---|---|---|---|---|---|---|---|---|---|
| ADSP-21469BBCCZ-3 | ADSP-21469 (عائلة SHARC) | 0,00 | 400,00 | غير متاح | 500000 | 0 | القضبان الأساسية/قضبان الإدخال والإخراج حسب ورقة البيانات | التركيب على السطح | -40 درجة مئوية إلى +85 درجة مئوية | 324-كرة CSP / 324-BGA 324-BGA | BC-324-1 (324-Ball CSP_BGA) |
ADSP-21469BBCCZ-3
الشركة المصنعة: الأجهزة التناظرية
الخلايا المنطقية: бк
شرائح المنطق: бк
ذاكرة الوصول العشوائي المدمجة (eRAM): 5 ميغابايت على الرقاقة SRAM على الرقاقة
الحزمة: SABP
درجة حرارة التشغيل: من 40 درجة مئوية إلى +85 درجة مئوية
المواصفات
تعريف رقم القطعة
ADSP-21469 is a fourth-generation SHARC floating-point digital signal processor built on Super Harvard Architecture, optimized for multi-channel audio processing and high-precision real-time signal computation.
BBCZ stands for industrial temperature grade, lead-free construction and 324-ball CSPBGA package measuring 19mm × 19mm. The suffix digit 3 denotes a rated core operating frequency of 400 MHz. The component is delivered in anti-static tray packaging for automated surface-mount PCB assembly.
المعلمات الأساسية لأداء النظام الكهربائي
Computing Core Features
- Core operating frequency: 400 MHz, supports SIMD parallel instruction execution to boost arithmetic throughput
- Arithmetic capability: 32-bit single-precision floating point, 40-bit extended precision floating point, together with 8/16/32-bit fixed-point calculation
- Integrated dedicated hardware accelerators for FFT transformation, FIR and IIR digital filtering, which greatly shortens the execution cycle of common signal algorithms
- Full source code compatibility with all legacy SHARC family DSP chips, facilitating program migration and iterative upgrading
On-Chip Memory Resources
Total embedded high-speed SRAM reaches 5 Mbits, which can be flexibly allocated as program storage space and data buffer space. Multi-group independent internal buses eliminate internal data transmission bottlenecks and ensure continuous streaming data processing performance.
واجهات طرفية مدمجة
- DAI configurable digital audio interface: supports I2S, TDM, SPDIF audio protocols and built-in 8-channel asynchronous sample rate converters
- 8 SPORT synchronous serial ports for direct connection with audio codec chips
- Two high-speed Link Ports, available for multi-DSP cascading and point-to-point large-volume data transmission
- Dual SPI buses, 1 UART, I2C bus, 16-channel PWM outputs and three programmable hardware timers
- Embedded 16-bit DDR2 external memory controller for expanding large-capacity off-chip data memory
- Advanced multi-channel DMA controller with scatter-gather and delay-line DMA functions, handling background data transmission without occupying core computing resources
- Standard IEEE 1149.1 JTAG debug port for program downloading, online debugging and system fault diagnosis
مواصفات مصدر الطاقة
- Core digital operating voltage: 1.05 V (nominal range 1.0 V ~ 1.1 V)
- Analog circuit and digital I/O voltage: 3.3 V
- No built-in non-volatile flash memory; application firmware must be loaded from external storage devices after power-on initialization
مواصفات التعبئة والتجميع
Encapsulated in compact 324-pin CSPBGA surface-mount package with overall dimensions 19 mm × 19 mm. The miniature outline is suitable for professional audio equipment, portable precision measuring instruments and embedded control mainboards with limited internal layout space.
Moisture Sensitivity Level is MSL3. All reflow soldering procedures must be completed within 168 hours once the vacuum packaging seal is broken. Anti-static tray packaging is adopted to meet the demands of large-scale industrial electronic production.
المعايير البيئية ومعايير الامتثال
Stable continuous operation is maintained across the industrial temperature range of -40°C to +85°C, adapting to indoor audio devices, medical diagnostic equipment, field monitoring instruments and automation control systems under variable ambient temperature and electromagnetic interference conditions.
Manufactured via full lead-free semiconductor processes, the device complies with global RoHS environmental directives and remains in continuous official production supply.
مجالات التطبيق النموذجية
Professional audio mixing consoles, multi-channel digital audio effects processing systems
Medical ultrasound diagnostic equipment real-time acoustic and image signal calculation modules
Acoustic analyzers, audio testing instruments and vibration noise fault diagnosis devices
Industrial embedded multi-channel signal acquisition and real-time spectrum analysis units
Vehicle-mounted multi-channel audio processing systems and public broadcasting digital matrix equipment
