Memory Chip Super‑Cycle: Samsung & SK Hynix Boost Capital Expenditure Sharply

According to latest industry statistics released August 2026, Samsung Electronics and SK Hynix raised semiconductor investment heavily during first half of this year. Combined capital expenditure hit 43.2 trillion KRW, growing 35.1% compared with last year Both vendors run memory fabs at nearly 100% capacity utilization rate.

Driven by AI large‑model servers, HBM and high‑capacity NAND flash keep strong market demand. Memory chips enter quantity‑and‑price‑rising super cycle. Market analysts point out memory semiconductor gradually transforms from traditional cyclical product to AI infrastructure component.

Supply side: New‑generation 1D DRAM and 400+‑layer V‑NAND development move forward. Samsung targets to finish 1D‑generation DRAM development in September 2026. Trial shipments of SK Hynix 375‑layer 4D NAND will start for major cloud customers this August. Buyers need to watch lead‑time changes for high‑bandwidth memory components.