| MODELO P/N | SERIE | NÚMERO DE LABORATORIOS/CLBS | GRADO DE VELOCIDAD | NÚMERO DE ELEMENTOS LÓGICOS / CELDAS | TOTAL BITS RAM | NÚMERO DE E/S | TENSIÓN - ALIMENTACIÓN | TIPO DE MONTAJE | TEMPERATURA DE FUNCIONAMIENTO | PAQUETE / ESTUCHE | PAQUETE DEL DISPOSITIVO DEL PROVEEDOR |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC4VLX25-11FFG668I | Virtex-4 SX | 2.688,00 | 0,00 | 24192 Elementos lógicos | 1.327.104 bits | 448 | 1,14V ~ 1,26V | Montaje en superficie | Comercial (0°C ~ +85°C) | 668-BBGA, FCBGA | 668-FCBGA (27×27) |
XC4VLX25-11FFG668I: Virtex-4 LX for Industrial High-Performance Logic
En XC4VLX25-11FFG668I is a member of the Xilinx Virtex-4 LX family, optimized specifically for high-performance logic applications. While the “SX” series targets DSP and the “FX” focuses on embedded processors, the LX series is the go-to for high-density logic, timing-critical interfacing, and general-purpose FPGA tasks.
This specific variant features the -11 speed grade y Industrial temperature rating, making it suitable for environments where thermal stability and timing closure are more demanding than standard commercial applications.
Especificaciones técnicas básicas
Células lógicas: 24,192
CLB Array (Rows x Cols): 48 x 72
Total Block RAM: 1,296 Kb
DSP48 Slices: 48
User I/O: 448 (Max)
Grado de velocidad: -11 (Mid-to-high performance tier for Virtex-4)
Gama de temperaturas: Industrial ($T_{j} = -40°C$ to $100°C$)
Paquete: FFG668 (Fine-pitch Flip-Chip BGA, Lead-Free/RoHS)
Hardware Design & Implementation Notes
When integrating or replacing the XC4VLX25-11FFG668I in an existing PCBA, engineers should prioritize the following:
Timing Closure: The -11 speed grade offers tighter propagation delays than the base -10. If you are replacing a -10 part with this -11, your bitstream will remain compatible, but verify that your hold-time requirements are still met given the faster silicon.
Thermal Management: The Industrial rating ($100°C$ max junction temperature) is critical for sealed enclosures. However, the FFG668 flip-chip package requires a clean thermal interface. Ensure the existing heatsink or TIM (Thermal Interface Material) is cleared of oxidation if performing a field replacement.
I/O Standards: The Virtex-4 SelectIO technology supports a wide array of standards (LVDS, SSTL, HSTL). Ensure the $V_{CCO}$ rails on your board match the banking requirements defined in your
.ucfor.xdcconstraints.
Legacy Support & Life Cycle
The Virtex-4 family uses a 90nm process technology. For modern maintenance, this device requires the Xilinx ISE Design Suite (14.7). It is important to note that this part is not compatible with Vivado. If you are troubleshooting configuration issues, remember that the Virtex-4 utilizes a bitstream encryption (AES) and a unique configuration memory cells (CMVs) structure that differs from earlier Spartan or later 7-Series architectures.
Póngase en contacto con LXB Semicon for availability, pricing, and technical support.
