| МОДЕЛЬ П/Н | СЕРИИ | КОЛИЧЕСТВО ЛАБОРАТОРИЙ/КЛБ | УРОВЕНЬ СКОРОСТИ | КОЛИЧЕСТВО ЛОГИЧЕСКИХ ЭЛЕМЕНТОВ / ЯЧЕЕК | ВСЕГО БИТОВ ОЗУ | КОЛИЧЕСТВО ВХОДОВ/ВЫХОДОВ | НАПРЯЖЕНИЕ - ПИТАНИЕ | ТИП КРЕПЛЕНИЯ | РАБОЧАЯ ТЕМПЕРАТУРА | УПАКОВКА / КЕЙС | УПАКОВКА УСТРОЙСТВА ПОСТАВЩИКА |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC4VLX25-11FFG668I | Virtex-4 SX | 2.688,00 | 0,00 | 24192 Логические элементы | 1 327 104 бит | 448 | 1,14 В ~ 1,26 В | Монтаж на поверхность | Коммерческий (0°C ~ +85°C) | 668-BBGA, FCBGA | 668-FCBGA (27×27) |
XC4VLX25-11FFG668I: Virtex-4 LX for Industrial High-Performance Logic
Сайт XC4VLX25-11FFG668I is a member of the Xilinx Virtex-4 LX family, optimized specifically for high-performance logic applications. While the “SX” series targets DSP and the “FX” focuses on embedded processors, the Серия LX is the go-to for high-density logic, timing-critical interfacing, and general-purpose FPGA tasks.
This specific variant features the -11 класс скорости и Промышленная температура, making it suitable for environments where thermal stability and timing closure are more demanding than standard commercial applications.
Технические характеристики ядра
-
Логические ячейки: 24,192
-
CLB Array (Rows x Cols): 48 x 72
-
Всего блоков оперативной памяти: 1,296 Kb
-
DSP48 Slices: 48
-
Пользовательский ввод/вывод: 448 (Max)
-
Класс скорости: -11 (Mid-to-high performance tier for Virtex-4)
-
Диапазон температур: Промышленность ($T_{j} = -40°C$ на $100°C$)
-
Упаковка: FFG668 (Fine-pitch Flip-Chip BGA, Lead-Free/RoHS)
Hardware Design & Implementation Notes
When integrating or replacing the XC4VLX25-11FFG668I in an existing PCBA, engineers should prioritize the following:
-
Timing Closure: The -11 speed grade offers tighter propagation delays than the base -10. If you are replacing a -10 part with this -11, your bitstream will remain compatible, but verify that your hold-time requirements are still met given the faster silicon.
-
Тепловое управление: The Industrial rating ($100°C$ max junction temperature) is critical for sealed enclosures. However, the FFG668 flip-chip package requires a clean thermal interface. Ensure the existing heatsink or TIM (Thermal Interface Material) is cleared of oxidation if performing a field replacement.
-
I/O Standards: The Virtex-4 SelectIO technology supports a wide array of standards (LVDS, SSTL, HSTL). Ensure the $V_{CCO}$ rails on your board match the banking requirements defined in your
.ucfили.xdcconstraints.
Legacy Support & Life Cycle
The Virtex-4 family uses a 90nm process technology. For modern maintenance, this device requires the Xilinx ISE Design Suite (14.7). It is important to note that this part is not compatible with Vivado. If you are troubleshooting configuration issues, remember that the Virtex-4 utilizes a bitstream encryption (AES) and a unique configuration memory cells (CMVs) structure that differs from earlier Spartan or later 7-Series architectures.
Связаться с LXB Semicon для получения информации о наличии, ценах и технической поддержке.
