| MODELO P/N | SERIE | NÚMERO DE LABORATORIOS/CLBS | GRADO DE VELOCIDAD | NÚMERO DE ELEMENTOS LÓGICOS / CELDAS | TOTAL BITS RAM | NÚMERO DE E/S | TENSIÓN - ALIMENTACIÓN | TIPO DE MONTAJE | TEMPERATURA DE FUNCIONAMIENTO | PAQUETE / ESTUCHE | PAQUETE DEL DISPOSITIVO DEL PROVEEDOR |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XCKU3P-2FFVB676C | Kintex® UltraScale+ | 20,34 | -2,00 | 355 950 LE | 31 641 600 bits | 272 | 0,850 V | Montaje en superficie | 0 °C – 100 °C | FCBGA-676 | 676-FCBGA (27×27) |
XCKU3P-2FFVB676C
Fabricante: Xilinx
Células lógicas: 3,780,000
Rebanadas lógicas: 590,000
RAM integrada (eRAM): 81 360 Kb (2260 bloques de RAM de 36 Kb)
E/S máxima por usuario: 350
Paquete: FFVB676 (BGA con chip invertido)
Grado de velocidad: -2
Temperatura de funcionamiento: Comercial (0°C a +85°C)
Especificaciones
Explicación del número de pieza
This is an AMD Xilinx Kintex UltraScale+ FPGA built on 16nm FinFET process, featuring integrated UltraRAM for large on-chip storage, oriented toward commercial high-speed data processing and low-latency embedded systems.
- XCKU3P: Entry-level model of Kintex UltraScale+ P-series, equipped with dedicated UltraRAM memory blocks
- -2: Speed Grade 2, balanced performance tier, striking a compromise between maximum operating frequency and power consumption
- FFVB676: 676-ball flip-chip FCBGA compact package
- C: Commercial temperature grade, junction temperature operating range: 0°C ~ +85°C
On-Chip Hardware Resources
Logic & DSP Computing Units
- Total Logic Cells: 221,280
- DSP48E2 arithmetic slices: 1128 units
Applied for FFT computation, digital filtering, intermediate wireless baseband processing, image algorithm acceleration and medium-scale matrix calculations
Embedded Memory Resources
- Total Block RAM: 14.5 Mb
- UltraRAM dedicated memory: 13.5 Mb, ideal for video frame buffers, deep packet buffering and large algorithm temporary storage
- LUT-based distributed RAM for ultra-low latency small-capacity cache
Clock Management Modules
Multiple MMCM and PLL clock management tiles are integrated on the chip. They support clock multiplication, division, arbitrary phase shifting and jitter reduction to fulfill timing demands of multi-clock high-speed digital systems.
High-Speed Transceivers & General I/O
- 8-channel GTH serial transceivers, maximum single-lane rate up to 16.375 Gbps
Supported protocols: PCIe Gen3, 10G Ethernet, JESD204B/C, Aurora
- Available user I/O pins: 280
Contains HR wide-voltage I/O banks and HP high-performance I/O banks, compatible with LVCMOS, LVDS, HSTL, SSTL and all mainstream differential signal standards
- Built-in SYSMON monitor: Real-time detection of die temperature, internal power supply voltages and external analog input signals
Power Supply Specifications
Nominal core logic voltage: 0.85 V
Separate independent power domains are allocated for core logic, memory arrays, transceivers and I/O interfaces. Dynamic voltage and frequency adjustment can be activated to lower power draw under light workloads.
Typical total power consumption: 10W ~ 30W, passive heat sinks suffice for compact commercial embedded hardware
Packaging & SMT Assembly Requirements
- Package: 676-pin flip-chip FCBGA ball grid array
- Moisture Sensitivity Level: MSL3; all reflow soldering shall be finished within 168 hours once vacuum packaging is opened
- Lead-free construction, fully RoHS compliant
- Supplied in anti-static trays for automated industrial PCB mass production
Environmental and Reliability Features
Designed for stable operation in indoor constant-temperature commercial environments only, not suitable for outdoor extreme low/high temperature industrial scenarios.
It supports 256-bit AES bitstream encryption for design IP protection, SEU radiation error correction and partial dynamic reconfiguration, delivering reliable performance for commercial vision devices, indoor communication equipment and desktop data acquisition systems.
Escenarios típicos de aplicación
- Indoor small cell base station baseband processing boards and compact network gateway modules
- Desktop multi-channel machine vision inspection equipment and industrial camera image processing units
- Bench-top oscilloscopes, signal analyzers and laboratory precision measurement instruments
- Desktop high-speed PCIe data acquisition and storage accelerator cards
- Commercial multi-screen video splicing and real-time video processing terminals
- Algorithm verification prototype boards and custom embedded commercial SOM core modules
