XC5VSX50T-1FFG665I

Fabricante: Xilinx
Células lógicas: 52,224
Rebanadas lógicas: 8,160
RAM integrada (eRAM): 1 728 Kb
Paquete: FFG665 (BGA con chip invertido)
Temperatura de funcionamiento: Industrial (-40°C a +100°C)

ENVÍANOS UN MENSAJE

    Especificaciones

    MODELO P/N SERIE NÚMERO DE LABORATORIOS/CLBS GRADO DE VELOCIDAD NÚMERO DE ELEMENTOS LÓGICOS / CELDAS TOTAL BITS RAM NÚMERO DE E/S TENSIÓN - ALIMENTACIÓN TIPO DE MONTAJE TEMPERATURA DE FUNCIONAMIENTO PAQUETE / ESTUCHE PAQUETE DEL DISPOSITIVO DEL PROVEEDOR
    XC5VSX50T-1FFG665I Virtex-5 SX 4,00 -1,00 52 224 4 866 048 360 0,95 V - 1,05 V Montaje en superficie -40 °C ~ +100 °C (I) 665-FBGA / FCBGA 665-FCBGA (≈ 27 × 27 mm)
    XC5VSX50T-1FFG665I Virtex-5 SX 4.080,00 -1,00 52224 4866048 360 0,95 V - 1,05 V Montaje en superficie -40 °C – +100 °C (I) 665-FBGA / FCBGA 665-FCBGA (27 × 27 mm)

    XC5VSX50T-1FFG665I FPGA – Product Overview

    En XC5VSX50T-1FFG665I es un FPGA de alto rendimiento de la familia Virtex-5 SX desarrollado por Xilinx, que ahora forma parte de AMD. This device was specifically designed for applications that require strong digital signal processing performance combined with flexible programmable logic.

    In many engineering projects, the Virtex-5 SX series is chosen when designers need to implement real-time signal processing directly in hardware. Instead of relying solely on CPUs or DSP processors, engineers can build parallel processing pipelines inside the FPGA fabric. The XC5VSX50T-1FFG665I offers a balanced mix of configurable logic blocks, embedded DSP48E slices, and on-chip memory resources, making it suitable for demanding telecom and industrial applications.

    En FFG665 package is a flip-chip BGA package with 665 pins, providing a compact footprint while still allowing high-density routing on multilayer PCBs. The -1 grado de velocidad is optimized for stable operation with lower power consumption compared with faster speed grades, which makes it common in embedded systems that run continuously.

    En Categoría de temperatura industrial (I) means the device supports a wider operating temperature range, typically −40°C to +100°C junction temperature, allowing it to operate reliably in industrial equipment, outdoor telecom cabinets, and rugged environments.

    Because many long-lifecycle systems were originally built around Virtex-5 devices, parts like the XC5VSX50T-1FFG665I are still widely used for maintenance, replacement, and continued production of existing platforms.


    Structured Technical Specifications

    Parámetro Especificación
    Fabricante Xilinx
    Familia de productos Virtex-5 SX FPGA
    Número de pieza XC5VSX50T-1FFG665I
    Células lógicas ~52,000 logic cells
    Lonchas DSP 288 porciones de DSP48E
    Bloque RAM ~4,7 MB
    Tipo de envase FFG665 (BGA con chip invertido)
    Número de agujas 665 pines
    Grado de velocidad -1
    Grado de temperatura Industrial
    Temperatura de funcionamiento -40°C to +100°C (junction)
    Tecnología de procesos 65 nm
    Transceptores RocketIO multi-gigabit transceivers
    Aplicaciones típicas DSP systems, telecom infrastructure, industrial processing

    Aplicaciones típicas

    Engineers typically use the XC5VSX50T-1FFG665I in systems where deterministic hardware processing is required. Some common examples include:

    • Wireless base station signal processing

    • Plataformas de radio definida por software (SDR)

    • Controladores de automatización industrial

    • Radar and imaging systems

    • High-speed data acquisition equipment

    • Plataformas de pruebas y medición

    In these applications, the FPGA can process large streams of data in parallel while maintaining predictable timing performance.


    FAQ (Optimized for Google AEO / Featured Snippets)

    What is the XC5VSX50T-1FFG665I?

    En XC5VSX50T-1FFG665I is a Virtex-5 SX series FPGA designed by Xilinx for high-performance digital signal processing applications. It combines programmable logic, embedded DSP slices, and high-speed connectivity for telecom, industrial, and data processing systems.

    What does FFG665 mean in the part number?

    FFG665 refers to the package type used by the FPGA. It is a flip-chip BGA package with 665 pines, designed for high-density PCB layouts and reliable signal integrity in high-speed systems.

    What does the “I” temperature grade indicate?

    En I stands for Rango de temperatura industrial, meaning the device can operate reliably in environments between approximately −40°C and +100°C junction temperature.

    Is the Virtex-5 SX series still used today?

    Yes. Even though newer FPGA families exist, Virtex-5 devices are still widely used in long-lifecycle industrial systems, telecom infrastructure, and legacy hardware platforms where redesigning the system would be costly.

    Where can engineers source XC5VSX50T-1FFG665I today?

    Distributors specializing in hard-to-find or legacy semiconductors, such as LXB Semicon, often provide sourcing support for Virtex-5 components used in maintenance and ongoing production programs.