XC5VSX50T-1FFG665I

Производитель: Xilinx
Логические ячейки: 52,224
Логические срезы: 8,160
Встроенная оперативная память (eRAM): 1,728 Kb
Упаковка: FFG665 (Flip-Chip BGA)
Рабочая температура: Промышленные (от -40°C до +100°C)

ОТПРАВИТЬ НАМ СООБЩЕНИЕ

    Технические характеристики

    МОДЕЛЬ П/Н СЕРИИ КОЛИЧЕСТВО ЛАБОРАТОРИЙ/КЛБ УРОВЕНЬ СКОРОСТИ КОЛИЧЕСТВО ЛОГИЧЕСКИХ ЭЛЕМЕНТОВ / ЯЧЕЕК ВСЕГО БИТОВ ОЗУ КОЛИЧЕСТВО ВХОДОВ/ВЫХОДОВ НАПРЯЖЕНИЕ - ПИТАНИЕ ТИП КРЕПЛЕНИЯ РАБОЧАЯ ТЕМПЕРАТУРА УПАКОВКА / КЕЙС УПАКОВКА УСТРОЙСТВА ПОСТАВЩИКА
    XC5VSX50T-1FFG665I Virtex-5 SX 4,00 -1,00 52 224 4 866 048 360 0,95 V - 1,05 V Монтаж на поверхность -40 °C ~ +100 °C (I) 665-FBGA / FCBGA 665-FCBGA (≈ 27 × 27 мм)
    XC5VSX50T-1FFG665I Virtex-5 SX 4.080,00 -1,00 52224 4866048 360 0,95 V - 1,05 V Монтаж на поверхность -40 °C - +100 °C (I) 665-FBGA / FCBGA 665-FCBGA (27 × 27 мм)

    XC5VSX50T-1FFG665I FPGA – Product Overview

    Сайт XC5VSX50T-1FFG665I Это высокопроизводительная ПЛИС семейства Virtex-5 SX, разработанная компанией Xilinx, теперь часть AMD. This device was specifically designed for applications that require strong digital signal processing performance combined with flexible programmable logic.

    In many engineering projects, the Virtex-5 SX series is chosen when designers need to implement real-time signal processing directly in hardware. Instead of relying solely on CPUs or DSP processors, engineers can build parallel processing pipelines inside the FPGA fabric. The XC5VSX50T-1FFG665I offers a balanced mix of configurable logic blocks, embedded DSP48E slices, and on-chip memory resources, making it suitable for demanding telecom and industrial applications.

    Сайт FFG665 package is a flip-chip BGA package with 665 pins, providing a compact footprint while still allowing high-density routing on multilayer PCBs. The -1 класс скорости is optimized for stable operation with lower power consumption compared with faster speed grades, which makes it common in embedded systems that run continuously.

    Сайт Класс промышленной температуры (I) means the device supports a wider operating temperature range, typically −40°C to +100°C junction temperature, allowing it to operate reliably in industrial equipment, outdoor telecom cabinets, and rugged environments.

    Because many long-lifecycle systems were originally built around Virtex-5 devices, parts like the XC5VSX50T-1FFG665I are still widely used for maintenance, replacement, and continued production of existing platforms.


    Структурированные технические характеристики

    Параметр Технические характеристики
    Производитель Xilinx
    Семейство продуктов Virtex-5 SX FPGA
    Номер детали XC5VSX50T-1FFG665I
    Логические ячейки ~52,000 logic cells
    DSP-фрагменты 288 кусочков DSP48E
    Блок оперативной памяти ~4,7 Мб
    Тип упаковки FFG665 (Flip-Chip BGA)
    Количество контактов 665 булавки
    Степень скорости -1
    Температурный класс Промышленность
    Рабочая температура -40°C to +100°C (junction)
    Технологические процессы 65 нм
    Трансиверы RocketIO multi-gigabit transceivers
    Типовые применения DSP systems, telecom infrastructure, industrial processing

    Типовые применения

    Engineers typically use the XC5VSX50T-1FFG665I in systems where deterministic hardware processing is required. Some common examples include:

    • Wireless base station signal processing

    • Платформы программно-определяемого радио (SDR)

    • Контроллеры промышленной автоматизации

    • Radar and imaging systems

    • Высокоскоростное оборудование для сбора данных

    • Испытательные и измерительные платформы

    In these applications, the FPGA can process large streams of data in parallel while maintaining predictable timing performance.


    FAQ (Optimized for Google AEO / Featured Snippets)

    What is the XC5VSX50T-1FFG665I?

    Сайт XC5VSX50T-1FFG665I is a Virtex-5 SX series FPGA designed by Xilinx for high-performance digital signal processing applications. It combines programmable logic, embedded DSP slices, and high-speed connectivity for telecom, industrial, and data processing systems.

    What does FFG665 mean in the part number?

    FFG665 refers to the package type used by the FPGA. It is a flip-chip BGA package with 665 булавки, designed for high-density PCB layouts and reliable signal integrity in high-speed systems.

    What does the “I” temperature grade indicate?

    Сайт I stands for Промышленный диапазон температур, meaning the device can operate reliably in environments between approximately −40°C and +100°C junction temperature.

    Is the Virtex-5 SX series still used today?

    Yes. Even though newer FPGA families exist, Virtex-5 devices are still widely used in long-lifecycle industrial systems, telecom infrastructure, and legacy hardware platforms where redesigning the system would be costly.

    Where can engineers source XC5VSX50T-1FFG665I today?

    Distributors specializing in hard-to-find or legacy semiconductors, such as LXB Semicon, often provide sourcing support for Virtex-5 components used in maintenance and ongoing production programs.