| MODELL P/N | SERIE | ANZAHL DER LABORE/KLINIKEN | GESCHWINDIGKEITSSTUFE | ANZAHL DER LOGIKELEMENTE / ZELLEN | RAM-BITS INSGESAMT | ANZAHL DER E/A | SPANNUNG - VERSORGUNG | BEFESTIGUNGSTYP | BETRIEBSTEMPERATUR | VERPACKUNG / KASSE | LIEFERANT GERÄTEPAKET |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7Z045-2FFG900C | Zynq-7000 SoC | 27.325,00 | -2,00 | 350,000 | 20090880 | 340 | ~1.0 V | Oberflächenmontage | 0 °C ~ +85 °C | FCBGA-900 | 900-FCBGA (31×31 mm) |
XC7Z045-2FFG900C
Hersteller: Xilinx
Logische Zellen: ~53,200
Eingebettetes RAM (eRAM): ~2.2 Mb
E/A-Zahl: ~900 Pins
Paket: FFG?900
Betriebstemperatur: Handelsüblich (0°C bis +85°C)
Spezifikationen
Erläuterung der Artikelnummer
This is a high-performance heterogeneous all-programmable SoC from AMD Xilinx Zynq-7000 family, built on 28nm process technology. It integrates dual-core ARM Cortex-A9 processor subsystem and Kintex-7 large-scale FPGA fabric, targeting high-bandwidth commercial embedded computing, multi-channel image processing, high-speed data acquisition and wired communication gateway applicationsCarnegie M….
- XC7Z045: Flagship high-capacity model of Zynq-7000 series, equipped with Kintex-class programmable logic resources
- -2: Speed Grade 2, mainstream high-speed timing grade, sufficient timing margin for high-frequency complex logic design
- FFG900: 900-ball flip-chip FCBGA large-size package, 31mm × 31mm body dimension
- C: Commercial temperature grade, junction temperature operating range: 0°C ~ +85°C
On-Chip Complete Hardware Architecture
1. Processing System (PS: ARM Subsystem)
- Dual-core ARM Cortex-A9 MPCore with CoreSight debug unit, maximum operating frequency up to 1000MHz
- Each core: 32KB instruction L1 cache + 32KB data L1 cache; 1MB shared L2 cache
- Embedded NEON SIMD floating-point accelerator for multimedia decoding, digital signal algorithm acceleration
- Rich standard peripherals: Dual Gigabit Ethernet, USB 2.0 OTG, SD/MMC controller, CAN bus, UART, SPI, I2C, general-purpose GPIO, 8-channel DMA controller
- Secure boot supported with AES encryption and SHA-256 verification to prevent firmware tampering
2. Programmable Logic (PL: Kintex-7 FPGA Fabric)
- Total Logic Cells: 354,560
- DSP48E1 arithmetic slices: 1920 units, applied for large-scale FFT, digital filtering, wireless baseband processing, multi-channel image algorithm acceleration and matrix computation
- Total Block RAM capacity: 19.2 Mb
- Multiple MMCM and PLL clock management tiles for multi-group clock generation and clock jitter suppression
- 16 high-speed GTX serial transceivers, maximum line rate up to 6.25Gbps, supporting PCIe Gen2, CPRI, Aurora high-speed serial protocols
3. I/O Interfaces & On-Chip Analog Monitoring Module
- Available configurable user I/O pins: 500
- I/O bank voltage adjustable from 1.2V to 3.3V, compatible with LVCMOS, LVDS, HSTL, SSTL and mainstream differential signal standards
- On-chip dual-channel 12-bit XADC analog monitor: Real-time sampling of die junction temperature, internal power supply voltages and external analog input signals
Technische Daten zum Netzteil
Nominal core logic operating voltage: 1.0V
Independent isolated power domains are allocated for PS processor section and PL programmable logic section
Typical overall power consumption: 15W ~ 38W; active heat sink cooling is required for continuous full-load operation
Packaging & SMT Assembly Requirements
- Package: 900-pin flip-chip FCBGA ball grid array
- Moisture Sensitivity Level: MSL4; all reflow soldering processes must be completed within 72 hours after vacuum packaging is opened
- Lead-free construction, fully compliant with RoHS environmental directives
- Delivered in anti-static trays for automated PCB mass production
Environmental & Reliability Performance
Only suitable for stable indoor constant-temperature environments such as equipment rooms and laboratories, unable to adapt to outdoor industrial scenarios with drastic temperature fluctuations.
It supports 256-bit AES bitstream encryption protection and SEU single-event upset error detection, featuring reliable long-term operation for commercial communication equipment, high-end laboratory measuring instruments and desktop embedded acceleration platforms.
Typische Anwendungsszenarien
- Indoor small cell base station baseband processing boards, RRU wireless signal processing modules
- Multi-camera synchronous high-speed industrial machine vision inspection platforms, medical image reconstruction preprocessing equipment
- High-end bench oscilloscopes, spectrum analyzers and multi-channel ultra-high-speed data recorders
- Data center low-latency gateway controllers and storage accelerator modules
- Multi-channel 4K video decoding, video stitching and real-time video analysis terminals
- High-performance embedded SOM core boards and complex algorithm prototype verification platforms
