| MODELL P/N | SERIE | ANZAHL DER LABORE/KLINIKEN | GESCHWINDIGKEITSSTUFE | ANZAHL DER LOGIKELEMENTE / ZELLEN | RAM-BITS INSGESAMT | ANZAHL DER E/A | SPANNUNG - VERSORGUNG | BEFESTIGUNGSTYP | BETRIEBSTEMPERATUR | VERPACKUNG / KASSE | LIEFERANT GERÄTEPAKET |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC6VLX240T-L1FF784I | Virtex-6 LXT | 0,00 | 18.840,00 | 241,152 | 15335424 | 400 | 0.95 - 1.05 V | Oberflächenmontage | -40°C - 100°C (I) | FCBGA-784 | 784-FCBGA |
XC6VLX240T-L1FF784I
Hersteller: Xilinx
Logische Zellen: 241,152
Logische Schnitte: 37,680
Eingebettetes RAM (eRAM): 14.976 Kb (832 × 18 Kb Block-RAM)
Maximale Benutzer-E/A: 360
Paket: FF784 (Flip-Chip BGA)
Geschwindigkeitsstufe: -1L
Betriebstemperatur: Industriell (-40°C bis +100°C)
Spezifikationen
Part Number Breakdown
This is a low-power optimized industrial-grade FPGA belonging to Xilinx Virtex-6 LXT family, fabricated on mature 40nm CMOS semiconductor process. It is optimized for ultra-low static and dynamic power consumption while retaining complete high-speed serial interfaces and abundant computing resources, designed for rugged airborne, vehicular, outdoor industrial and portable military embedded systems that require strict power budget control and stable operation across full wide industrial temperature range.
- XC6VLX240T: Mid-large density device of Virtex-6 LXT lineup; LXT denotes the variant integrated with GTX high-speed serial transceivers
- L1: Low-power optimized Speed Grade 1. Core supply voltage is lowered to reduce overall power dissipation significantly, timing parameters are tuned for power efficiency rather than maximum operating frequency, ideal for battery-powered and thermal-limited devices
- FFG784: 784-ball flip-chip FCBGA package with 29×29mm outline, moderate package size balances hardware miniaturization and sufficient configurable I/O resources
- I: Industrial temperature grade, junction temperature operating range: -40°C ~ +100°C
On-Chip Hardware Resource Specifications
1. General Programmable Logic Resources
- Total Logic Cells: 241,152
- Configurable Slices (CLBs): 37,680
- Total Flip-Flops: 301,440
- Total LUT Lookup Tables: 150,720
2. Arithmetic & Embedded Memory Resources
- DSP48E1 dedicated arithmetic units: 1,064 units, applicable to digital filtering, large-scale FFT computation, communication baseband modulation/demodulation, radar signal preprocessing and medium-sized matrix arithmetic acceleration
- Total Block RAM Capacity: 15,335 Kb, used for image frame buffering, deep FIFO data queues, waveform storage and algorithm parameter lookup tables
- Distributed RAM Capacity: 5,328 Kb
3. Clock Management Subsystem
- 12 MMCM clock management tiles
- 12 PLL phase-locked loops
Supports multi-clock domain generation, phase fine offset adjustment, clock delay compensation and high-frequency jitter attenuation, meeting strict synchronous timing requirements of complex multi-module digital systems
4. Serielle Hochgeschwindigkeits-Transceiver
- 12 channels of GTX differential high-speed transceivers
Maximum achievable line rate: 6.6 Gbps, compatible with PCIe Gen2, Aurora, CPRI, Gigabit Ethernet and JESD204 mainstream serial communication protocols
Embedded hard PCI Express 2.0 endpoint block supports flexible lane configuration for rapid high-speed interface development
5. I/O Interfaces & On-Chip System Monitoring Module
- User configurable I/O pins: 400
I/O bank supply voltage adjustable between 1.2V and 3.3V, fully compliant with LVCMOS, LVDS, HSTL, SSTL and all universal differential signal standards
Integrated dual-channel 12-bit System Monitor XADC module, continuously monitors die junction temperature, all internal power rail voltages and external analog input signals in real time
Power Supply Characteristics
Nominal core operating voltage for L1 low-power variant: 0.91V ~ 0.97V, lower than standard speed grade counterparts for power reduction
Independent isolated power domains are assigned to logic fabric, Block RAM, DSP array and high-speed transceivers separately
Typical overall power consumption range: 6W ~ 19W; compact passive heat sinks can satisfy conventional continuous operation, low-load scenarios support natural convection cooling
Packaging & SMT Assembly Requirements
- Package Type: 784-pin flip-chip FCBGA ball grid array (29mm × 29mm)
- Moisture Sensitivity Level: MSL4; all reflow soldering processes must be completed within 72 hours after vacuum packaging is unsealed
- Lead-free packaging design, fully compliant with RoHS environmental directives
- Delivered and stored in anti-static trays to prevent electrostatic damage during automated PCB mass production
Environmental Adaptability & Reliability
The chip maintains long-term stable operation under extreme temperature swings, mechanical shock, vibration and strong electromagnetic interference harsh environments. It supports AES bitstream encryption protection, multi-bitstream fallback reconfiguration and SEU single-event upset detection, with enhanced radiation tolerance and thermal robustness suitable for aerospace, vehicle-mounted and field rugged deployment.
Typische Anwendungsszenarien
- Vehicular multi-sensor signal processing units, onboard communication gateway equipment
- Portable software-defined radio baseband modules, field secure communication terminals
- Airborne lightweight radar echo preprocessing, flight data acquisition and forwarding boards
- Wide-temperature industrial high-speed data acquisition analyzers, vibration monitoring main control units
- Battery-powered portable signal generators and spectrum measurement instruments
- Rugged VPX embedded computing core boards and low-power algorithm prototype verification platforms
