| MODELL P/N | SERIE | ANZAHL DER LABORE/KLINIKEN | GESCHWINDIGKEITSSTUFE | ANZAHL DER LOGIKELEMENTE / ZELLEN | RAM-BITS INSGESAMT | ANZAHL DER E/A | SPANNUNG - VERSORGUNG | BEFESTIGUNGSTYP | BETRIEBSTEMPERATUR | VERPACKUNG / KASSE | LIEFERANT GERÄTEPAKET |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC4VLX40-11FFG668I | Virtex-4 LX | 4.608,00 | -11,00 | 41472 | 1769472 | 448 | 1,14 V ~ 1,26 V | Oberflächenmontage | -40 °C ~ +100 °C (industriell) | 668-BBGA (FCBGA) | 668-FCBGA |
XC4VLX40-11FFG668I: High-Speed Industrial FPGA for Mission-Critical Logic
Die XC4VLX40-11FFG668I is a high-performance, industrial-grade member of the Xilinx Virtex®-4 LX family. It is specifically binned for the -11 Geschwindigkeitsstufe, providing the fastest logic switching and tighter timing margins required for high-frequency digital signal processing. Engineered on the 90nm ASMBL™ architecture, this FPGA delivers a robust balance of 41k logic cells and versatile I/O capabilities, all within a ruggedized Industrial Temperature (-40°C to +100°C) envelope.
For hardware engineers, the “11I” combination is the gold standard for applications where timing closure is difficult and the operating environment is unpredictable.
Engineering Core Features
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Premium Speed Grade (-11): Provides enhanced frequency headroom, allowing for more complex logic levels between clock edges. This is critical for stabilizing 300MHz+ internal data paths.
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Industrial Thermal Resilience: Rated for -40°C to +100°C Tj. Unlike commercial parts, this device maintains its timing specifications across extreme temperature fluctuations, making it essential for outdoor infrastructure and heavy industrial control.
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Advanced Memory & DSP Integration: Ausgestattet mit 1,728 Kb of Block RAM und 64 dedicated XtremeDSP™ slices. The DSP48 blocks allow for efficient, hard-coded arithmetic acceleration without consuming standard logic gates.
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High-Density SelectIO™: Die FFG668-Paket bricht aus 448 Benutzer-E/As, supporting a vast range of signaling standards (LVDS, HSTL, SSTL). The Flip-Chip (FFG) design ensures low-inductance paths, significantly reducing ground bounce and EMI.
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Lead-Free RoHS Compliance: Die “FFG” designation ensures the device meets all modern environmental regulations for global distribution without sacrificing thermal performance.
Matrix der technischen Spezifikationen
| Merkmal | Spezifikation |
| Logische Zellen | 41,472 |
| Block-RAM insgesamt | 1.728 Kb |
| DSP48-Scheiben | 64 |
| Benutzer E/As | 448 |
| Geschwindigkeitsstufe | -11 (High-Performance) |
| Temperatur Grad | Industriell (-40°C bis +100°C) |
| Paket | FFG668 (Lead-Free Flip-Chip BGA) |
| Kernspannung | 1.2V |
Why Specify the LX40-11I?
1. Precision Timing Under Load
In complex RTL designs, routing congestion often eats into your timing budget. The -11 Geschwindigkeitsstufe provides the necessary slack to ensure your design hits 200MHz-350MHz clock targets even at high logic utilization levels.
2. Thermal Stability for Long-Lifecycle Projects
Industrial systems often face “hot spots” within enclosures. Selecting the Industriell (-I) grade provides an extra 15°C of safety margin over commercial parts, preventing thermal-induced logic errors and extending the Mean Time Between Failures (MTBF) of your end product.
3. Optimized Footprint for Multi-Interface Bridging
The FFG668 package strikes an excellent balance between pin-count and PCB routing complexity. It is large enough to handle wide DDR2 or QDR memory interfaces but compact enough for high-density line cards and modular industrial controllers.
Ziel-Anwendungen
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Luft- und Raumfahrt & Verteidigung: Ruggedized communication bridges and telemetry systems.
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Energy & Grid: Real-time power monitoring and high-speed protection relays.
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Automated Test Equipment (ATE): High-speed pin electronics and pattern generators.
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Telekommunikation: Small cell base stations and outdoor backhaul equipment.
