Spezifikationen
This is a high-performance HDMI to MIPI DSI video bridge IC produced by Toshiba, dedicated to converting HDMI input video signals into dual-channel MIPI DSI differential serial output, serving as core protocol conversion chip for small-size high-resolution OLED and LCD display screens.
Part Number Definition
TC358870XBG is the official complete part number of this bridge chip series, XBG corresponds to standard FBGA packaging version with complete function configuration and mass production specification.
Core Function and Electrical Parameters
The chip adopts HDMI 1.4b receiving input, maximum input clock frequency 297MHz, peak total video bandwidth reaches 7.2Gbps. It supports 4K 3840×2160 resolution at 30fps, 2560×1600 at 60fps and 1080P at 120fps frame rate input, compatible with RGB and YCbCr multiple color encoding formats and built-in color space conversion module. Output side provides two groups of MIPI DSI transmit channels, each group supports 4 data lanes with single lane rate up to 1Gbps, total 8 lanes can drive ultra-high definition display panels. It parses HDMI embedded audio signals and outputs via I2S or TDM audio interface for external audio decoding chips. Multi-group independent power supply design is adopted: core and PLL circuit 1.1V, MIPI interface 1.2V, HDMI and IO peripheral 3.3V. The chip supports I2C register configuration for parameter adjustment, and integrates HDCP copy protection decoding function to adapt to encrypted video signal sources. Low-latency transmission architecture is applied to reduce display delay for real-time image transmission scenarios.
Packaging and Assembly Specifications
Package type is 80-pin VFBGA surface mount packaging, overall dimension 7mm×7mm with ball pitch 0.65mm. It belongs to MSL3 moisture sensitive device, reflow soldering work must be finished within 168 hours after opening original vacuum packaging. Tape-and-reel tray packaging is available to match automatic SMT placement equipment on production lines.
Environmental and Compliance Standards
Operating temperature range covers -40℃ to +85℃, suitable for industrial control equipment, vehicle electronic systems and portable wearable devices. The product is lead-free and meets universal environmental restriction standards. Compact BGA packaging greatly saves PCB layout space and is convenient for miniaturized display module design.
Typische Anwendungsbereiche
AR/VR head-mounted near-eye display modules and portable helmet display equipment Industrial embedded human-machine operation panels and miniature instrument high-definition display units Vehicle auxiliary display screens, rear entertainment small-size display and dashboard expansion screen conversion boards Single board computer external secondary screen drive modules and Raspberry Pi expansion display accessories Medical portable inspection equipment, handheld detection terminals and wearable device display drive circuit
LXB Semicon supplies original Toshiba TC358870XBG HDMI to MIPI DSI display bridge integrated circuit
