STM32F446RET6

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    Spezifikationen

    The STM32F446xC/E devices are based on the high-performance Arm® Cortex®-M4 32-bit RISC core operating at a frequency of up to 180 MHz. The Cortex-M4 core features a floating point unit (FPU) single precision supporting all Arm® single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) that enhances application security.

    The STM32F446xC/E devices incorporate high-speed embedded memories (flash memory up to 512 Kbytes, up to 128 Kbytes of SRAM), up to 4 Kbytes of backup SRAM, and an extensive range of enhanced I/Os and peripherals connected to two APB buses, two AHB buses and a 32-bit multi-AHB bus matrix.

    All devices offer three 12-bit ADCs, two DACs, a low-power RTC, twelve general-purpose 16-bit timers including two PWM timers for motor control, two general-purpose 32-bit timers.

    They also feature standard and advanced communication interfaces.

    Wichtigste Merkmale
    • Kern: Arm® 32-Bit-Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator) allowing 0-wait state execution from flash memory, frequency up to 180 MHz, MPU, 225 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
    • Erinnerungen
      • 512 Kbytes of flash memory
      • 128 Kbytes of SRAM
      • Flexible external memory controller with up to 16-bit data bus: SRAM, PSRAM, SDRAM/LPSDR SDRAM, NOR/NAND flash memories
      • Dual mode QuadSPI interface
    • Parallele LCD-Schnittstelle, 8080/6800-Modi
    • Takt-, Reset- und Versorgungsmanagement
      • 1.7 V to 3.6 V application supply and I/Os
      • POR, PDR, PVD und BOR
      • Quarzoszillator von 4 bis 26 MHz
      • Internal 16 MHz factory-trimmed RC (1% accuracy)
      • 32-kHz-Oszillator für RTC mit Kalibrierung
      • Interner 32-kHz-RC mit Kalibrierung
    • Low power
      • Ruhe-, Stopp- und Standby-Modus
      • VBAT supply for RTC, 20×32 bit backup registers plus optional 4 KB backup SRAM
    • 3× 12-bit, 2.4 MSPS ADC: up to 24 channels and 7.2 MSPS in triple interleaved mode
    • 2× 12-bit D/A converters
    • General-purpose DMA: 16-stream DMA controller with FIFOs and burst support
    • Up to 17 timers: 2x watchdog, 1x SysTick timer and up to twelve 16-bit and two 32-bit timers up to 180 MHz, each with up to four IC/OC/PWM or pulse counter
    • Debug mode
      • SWD and JTAG interfaces
      • Cortex®-M4 Trace Macrocell™
    • Up to 114 I/O ports with interrupt capability
      • Up to 111 fast I/Os up to 90 MHz
      • Up to 112 5 V-tolerant I/Os
    • Up to 20 communication interfaces
      • SPDIF-Rx
      • Up to 4× I2C-Schnittstellen (SMBus/PMBus)
      • Up to four USARTs and two UARTs (11.25 Mbit/s, ISO7816 interface, LIN, IrDA, modem control)
      • Up to four SPIs (45 Mbits/s), three with muxed I2S for audio class accuracy via internal audio PLL or external clock
      • 2x SAI (serial audio interface)
      • 2× CAN (2.0B Active)
      • SDIO-Schnittstelle
      • Consumer electronics control (CEC) I/F
    • Erweiterte Konnektivität
      • USB 2.0 Full-Speed-Geräte-/Host-/OTG-Controller mit integriertem PHY
      • USB 2.0 High-Speed-/Full-Speed-Geräte-/Host-/OTG-Controller mit dediziertem DMA, integriertem Full-Speed-PHY und ULPI
      • Dedicated USB power rail enabling on-chip PHYs operation throughout the entire MCU power supply range
    • 8- to 14-bit parallel camera interface up to 54 Mbytes/s
    • CRC-Berechnungseinheit
    • RTC: subsecond accuracy, hardware calendar
    • 96-Bit-eindeutige ID