XC5VLX30-1FFG676C

Üretici firma: Xilinx Mantık Hücreleri: 30,720 Mantık Dilimleri: 4,800 Gömülü RAM (eRAM): 1,728 Kb (96 × 18Kb Block RAM) Paket: FFG676 (Flip-Chip BGA) Çalışma Sıcaklığı: Ticari (0°C ila +85°C)

BIZE MESAJ GÖNDERIN

    Teknik Özellikler

    MODEL P/NSERİLERLABORATUVAR/CLB SAYISIHIZ DERECESİMANTIK ELEMANI / HÜCRE SAYISITOPLAM RAM BİTLERİG/Ç SAYISIVOLTAJ - BESLEMEMONTAJ TİPİÇALIŞMA SICAKLIĞIPAKET / KASATEDARIKÇI CIHAZ PAKETI
    XC5VLX30-1FFG676CVirtex-5 LX2.400,00-1,003072011796484000.95 V – 1.05 VYüzey Montajı0 °C – +85 °C (C)676-FBGA / FCBGA676-FCBGA (≈27 × 27 mm)

    The XC5VLX30-1FFG676C is a cost-effective FPGA solution for commercial environments, ideal for designs that do not require extended temperature ranges.

    Uygulamalar

    • Consumer electronics (high-end embedded)

    • Communication modules

    • Interface control boards

    Practical Insight

    For indoor applications, many customers prefer the “C” version to reduce cost while maintaining design compatibility.