| MODEL P/N | SERİLER | LABORATUVAR/CLB SAYISI | HIZ DERECESİ | MANTIK ELEMANI / HÜCRE SAYISI | TOPLAM RAM BİTLERİ | G/Ç SAYISI | VOLTAJ - BESLEME | MONTAJ TİPİ | ÇALIŞMA SICAKLIĞI | PAKET / KASA | TEDARIKÇI CIHAZ PAKETI |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC5VFX30T-1FFG665I | Virtex-5 FXT | 2.560,00 | -1,00 | 32768 | 3276800 | 360 | 0,95 V-1,05 V | Yüzey Montajı | -40 °C ~ +100 °C | 665-FBGA, FCBGA | 665-FCPBGA (27×27 mm) |
Xilinx XC5VFX30T-1FFG665I | Virtex-5 FXT FPGA – Industrial Embedded Solution
Bu XC5VFX30T-1FFG665I is a versatile, high-performance FPGA within the Xilinx Virtex-5 FXT family, specifically designed for embedded processing and high-speed serial communication in Endüstriyel (-40°C ila +100°C) environments. By integrating a hard-core PowerPC® 440 processor and RocketIO™ GTX alıcı-vericileri into a compact 665-pin package, it offers a powerful System-on-Chip (SoC) capability for space-constrained applications.
At LXB Semicon, we specialize in sourcing and verifying high-reliability Xilinx components, ensuring your industrial projects remain on track with genuine, factory-spec silicon.
Çekirdek Teknik Özellikler
| Özellik | Detaylı Şartname |
| Mantık Hücreleri | 32,768 |
| Gömülü İşlemci | 1 x PowerPC® 440 (up to 550 MHz) |
| Alıcı-Vericiler | 8 x RocketIO™ GTX (6.5 Gbps) |
| DSP48E Dilimleri | 64 |
| Toplam Blok RAM | 2,448 Kb |
| Çalışma Sıcaklığı | -40°C ila +100°C (Endüstriyel Sınıf) |
| Paket | FFG665 (Flip-Chip BGA, Lead-Free) |
| Hız Sınıfı | -1 (Standart Performans) |
Why the XC5VFX30T-1FFG665I is the Professional Choice
The “FX30T” model is uniquely positioned for designers who need the advanced features of the Virtex-5 architecture but in a smaller logic footprint and package.
1. True Industrial-Grade Reliability
Bu -I suffix guarantees that this FPGA will maintain timing and logic integrity under extreme temperature fluctuations. This makes it the standard choice for outdoor telecommunications, rail signaling, and heavy-duty factory automation.
2. High-Speed Serial Efficiency
With 8 GTX transceivers, the XC5VFX30T supports high-bandwidth protocols like PCIe, SATA, ve Gigabit Ethernet without the need for external PHY chips, reducing your overall BOM cost and PCB complexity.
3. PowerPC 440 Hard Core
Unlike soft-core processors that consume valuable logic fabric, the integrated PowerPC block provides a deterministic, high-frequency execution environment for complex control algorithms and operating systems like VxWorks or Linux.
4. Compact FFG665 Footprint
The 665-pin package provides a high I/O-to-size ratio, allowing for advanced processing power in compact modular designs and ruggedized handheld equipment.
The LXB Semicon Advantage: Trust & Quality (EEAT)
Sourcing mature or specialized Xilinx components requires a partner you can trust. LXB Semicon ensures excellence through:
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100% Originality Guarantee: We provide only authentic Xilinx (now AMD) silicon. Each XC5VFX30T-1FFG665I is verified through our strict incoming inspection process.
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Specialized Storage: All components are kept in climate-controlled, ESD-protected environments to prevent moisture-induced damage during reflow (MSL compliance).
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Technical Traceability: We offer Date Code (D/C) and Lot Code transparency to meet the documentation requirements of industrial and aerospace clients.
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Swift Global Response: Our logistics network ensures that even “hard-to-find” industrial parts reach your production line with minimal lead time.
Sıkça Sorulan Sorular (SSS)
Q: Is the XC5VFX30T-1FFG665I compatible with newer Xilinx software? A: This device is supported by the Xilinx ISE® Design Suite (up to v14.7). It is not compatible with Vivado, so please ensure your legacy environment is ready for deployment.
Q: Can I replace a Commercial (-C) version with this Industrial (-I) version? A: Yes. The industrial version covers the entire commercial temperature range and offers higher reliability. It is a recommended “up-grade” for systems operating in unpredictable environments.
S: FFG665 paketinin faydası nedir? A: The FFG665 is a lead-free, RoHS-compliant flip-chip BGA. It offers superior thermal dissipation and signal integrity compared to older wire-bond packages.
LXB Semicon'dan Fiyat Teklifi İsteyin Don’t let supply chain gaps delay your project. Contact LXB Semicon today for live inventory status, competitive pricing, and the full datasheet for the XC5VFX30T-1FFG665I.
