| МОДЕЛЬ П/Н | СЕРИИ | КОЛИЧЕСТВО ЛАБОРАТОРИЙ/КЛБ | УРОВЕНЬ СКОРОСТИ | КОЛИЧЕСТВО ЛОГИЧЕСКИХ ЭЛЕМЕНТОВ / ЯЧЕЕК | ВСЕГО БИТОВ ОЗУ | КОЛИЧЕСТВО ВХОДОВ/ВЫХОДОВ | НАПРЯЖЕНИЕ - ПИТАНИЕ | ТИП КРЕПЛЕНИЯ | РАБОЧАЯ ТЕМПЕРАТУРА | УПАКОВКА / КЕЙС | УПАКОВКА УСТРОЙСТВА ПОСТАВЩИКА |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC5VFX30T-1FFG665I | Virtex-5 FXT | 2.560,00 | -1,00 | 32768 | 3276800 | 360 | 0,95 В - 1,05 В | Монтаж на поверхность | -40 °C ~ +100 °C | 665-FBGA, FCBGA | 665-FCPBGA (27×27 мм) |
Xilinx XC5VFX30T-1FFG665I | Virtex-5 FXT FPGA – Industrial Embedded Solution
Сайт XC5VFX30T-1FFG665I is a versatile, high-performance FPGA within the Xilinx Virtex-5 FXT family, specifically designed for embedded processing and high-speed serial communication in Промышленные (от -40°C до +100°C) environments. By integrating a hard-core PowerPC® 440 процессор и Трансиверы RocketIO™ GTX into a compact 665-pin package, it offers a powerful System-on-Chip (SoC) capability for space-constrained applications.
На сайте LXB Semicon, we specialize in sourcing and verifying high-reliability Xilinx components, ensuring your industrial projects remain on track with genuine, factory-spec silicon.
Технические характеристики ядра
| Характеристика | Подробная спецификация |
| Логические ячейки | 32,768 |
| Встроенный процессор | 1 x PowerPC® 440 (up to 550 MHz) |
| Трансиверы | 8 x RocketIO™ GTX (6.5 Gbps) |
| Ломтики DSP48E | 64 |
| Всего блоков оперативной памяти | 2,448 Kb |
| Рабочая температура | -40°C to +100°C (Industrial Grade) |
| Пакет | FFG665 (Flip-Chip BGA, Lead-Free) |
| Степень скорости | -1 (стандартное исполнение) |
Why the XC5VFX30T-1FFG665I is the Professional Choice
The “FX30T” model is uniquely positioned for designers who need the advanced features of the Virtex-5 architecture but in a smaller logic footprint and package.
1. True Industrial-Grade Reliability
Сайт -I suffix guarantees that this FPGA will maintain timing and logic integrity under extreme temperature fluctuations. This makes it the standard choice for outdoor telecommunications, rail signaling, and heavy-duty factory automation.
2. High-Speed Serial Efficiency
With 8 GTX transceivers, the XC5VFX30T supports high-bandwidth protocols like PCIe, SATA, и Gigabit Ethernet without the need for external PHY chips, reducing your overall BOM cost and PCB complexity.
3. PowerPC 440 Hard Core
Unlike soft-core processors that consume valuable logic fabric, the integrated PowerPC block provides a deterministic, high-frequency execution environment for complex control algorithms and operating systems like VxWorks or Linux.
4. Compact FFG665 Footprint
The 665-pin package provides a high I/O-to-size ratio, allowing for advanced processing power in compact modular designs and ruggedized handheld equipment.
The LXB Semicon Advantage: Trust & Quality (EEAT)
Sourcing mature or specialized Xilinx components requires a partner you can trust. LXB Semicon ensures excellence through:
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100% Originality Guarantee: We provide only authentic Xilinx (now AMD) silicon. Each XC5VFX30T-1FFG665I is verified through our strict incoming inspection process.
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Specialized Storage: All components are kept in climate-controlled, ESD-protected environments to prevent moisture-induced damage during reflow (MSL compliance).
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Technical Traceability: We offer Date Code (D/C) and Lot Code transparency to meet the documentation requirements of industrial and aerospace clients.
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Swift Global Response: Our logistics network ensures that even “hard-to-find” industrial parts reach your production line with minimal lead time.
Часто задаваемые вопросы (FAQ)
Q: Is the XC5VFX30T-1FFG665I compatible with newer Xilinx software? A: This device is supported by the Xilinx ISE® Design Suite (up to v14.7). It is not compatible with Vivado, so please ensure your legacy environment is ready for deployment.
Q: Can I replace a Commercial (-C) version with this Industrial (-I) version? A: Yes. The industrial version covers the entire commercial temperature range and offers higher reliability. It is a recommended “up-grade” for systems operating in unpredictable environments.
Q: What is the benefit of the FFG665 package? A: The FFG665 is a lead-free, RoHS-compliant flip-chip BGA. It offers superior thermal dissipation and signal integrity compared to older wire-bond packages.
Request a Quote from LXB Semicon Don’t let supply chain gaps delay your project. Contact LXB Semicon today for live inventory status, competitive pricing, and the full datasheet for the XC5VFX30T-1FFG665I.
