XC5VFX130T-1FF1738I

Üretici firma: Xilinx Mantık Hücreleri: 130,560 Mantık Dilimleri: 20,480 Gömülü RAM (eRAM): 6.048 Kb (336 × 18Kb Blok RAM) Paket: FF1738 (Flip-Chip BGA) Çalışma Sıcaklığı: Endüstriyel (-40°C ila +100°C)

BIZE MESAJ GÖNDERIN

    Teknik Özellikler

    MODEL P/N SERİLER LABORATUVAR/CLB SAYISI HIZ DERECESİ MANTIK ELEMANI / HÜCRE SAYISI TOPLAM RAM BİTLERİ G/Ç SAYISI VOLTAJ - BESLEME MONTAJ TİPİ ÇALIŞMA SICAKLIĞI PAKET / KASA TEDARIKÇI CIHAZ PAKETI
    XC5VFX130T-1FF1738I Virtex-5 FXT 10.240,00 -1,00 131072 10985472 840 0,95 V-1,05 V Yüzey Montajı -40 °C ~ +100 °C 1738-FBGA, FCBGA 1738-FCPBGA (42,5×42,5 mm)

    XC5VFX130T-1FF1738I – Xilinx Virtex-5 FXT FPGA

    Bu XC5VFX130T-1FF1738I yüksek kapasiteli bir FPGA'dır. Xilinx Virtex-5 FXT ailesi, gerektiren sistemler için tasarlanmıştır. embedded processing, high-speed serial interfaces, and a large logic fabric tek bir cihaz içinde. At LXB Semicon, this part is typically supplied for industrial and communications platforms that value architectural maturity, predictable timing, and long-term availability.

    Mantık Kaynakları ve Gömülü İşleme

    The XC5VFX130T provides approximately 130K logic cells, offering sufficient capacity for complex datapaths, multi-channel data processing, and custom hardware acceleration. A key characteristic of the FXT family is the integration of çift PowerPC® 440 işlemci, enabling designers to implement control logic, protocol handling, and real-time system management directly inside the FPGA.

    Bu -1 hız derecesi emphasizes stable and well-characterized timing performance, making it suitable for designs where reliability and deterministic behavior are more important than maximum clock frequency.

    High-Speed Serial Communication

    Bu cihaz şunları bir araya getirir RocketIO™ GTX alıcı-vericileri, supporting high-speed serial standards such as PCI Express, Serial RapidIO, Gigabit Ethernet backplanes, and proprietary point-to-point links. By integrating the serial interfaces on-chip, system designers can reduce external components and simplify signal integrity management.

    On-Chip Memory and System Design

    A substantial amount of Blok RAM is available for buffering, packet queues, and local memory for the embedded processors. This helps reduce external memory access, improves latency control, and supports consistent performance in real-time systems.

    The Virtex-5 FXT platform is supported by a mature Xilinx toolchain and a wide range of proven IP cores, which remains valuable for long-life products and maintenance-oriented projects.

    Ambalaj ve Endüstriyel Sıcaklık Sınıfı

    Bu 1738-ball flip-chip BGA package provides a very high pin count, allowing flexible I/O assignment and support for interface-dense board designs.
    Bu endüstriyel sıcaklık sınıfı (I) ensures reliable operation across extended temperature ranges, making this device suitable for industrial automation, outdoor communication equipment, and other demanding environments.

    Tipik Uygulamalar

    The XC5VFX130T-1FF1738I is commonly used in:

    • Telecommunications and networking infrastructure

    • Donanım-yazılım ortak tasarımı ile gömülü işleme platformları

    • Endüstriyel kontrol ve otomasyon sistemleri

    • High-speed data acquisition and signal processing equipment

    • Long-life and legacy system support