| MODEL P/N | SERİLER | LABORATUVAR/CLB SAYISI | HIZ DERECESİ | MANTIK ELEMANI / HÜCRE SAYISI | TOPLAM RAM BİTLERİ | G/Ç SAYISI | VOLTAJ - BESLEME | MONTAJ TİPİ | ÇALIŞMA SICAKLIĞI | PAKET / KASA | TEDARIKÇI CIHAZ PAKETI |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC5VFX130T-1FF1738I | Virtex-5 FXT | 10.240,00 | -1,00 | 131072 | 10985472 | 840 | 0.95 V–1.05 V | Yüzey Montajı | -40 °C ~ +100 °C | 1738-FBGA, FCBGA | 1738-FCPBGA (42.5×42.5 mm) |
XC5VFX130T-1FF1738I – Xilinx Virtex-5 FXT FPGA
Bu XC5VFX130T-1FF1738I is a high-capacity FPGA from the Xilinx Virtex-5 FXT family, designed for systems that require embedded processing, high-speed serial interfaces, and a large logic fabric within a single device. At LXB Semicon, this part is typically supplied for industrial and communications platforms that value architectural maturity, predictable timing, and long-term availability.
Logic Resources and Embedded Processing
The XC5VFX130T provides approximately 130K logic cells, offering sufficient capacity for complex datapaths, multi-channel data processing, and custom hardware acceleration. A key characteristic of the FXT family is the integration of dual PowerPC® 440 processors, enabling designers to implement control logic, protocol handling, and real-time system management directly inside the FPGA.
Bu -1 hız derecesi emphasizes stable and well-characterized timing performance, making it suitable for designs where reliability and deterministic behavior are more important than maximum clock frequency.
High-Speed Serial Communication
This device integrates RocketIO™ GTX alıcı-vericileri, supporting high-speed serial standards such as PCI Express, Serial RapidIO, Gigabit Ethernet backplanes, and proprietary point-to-point links. By integrating the serial interfaces on-chip, system designers can reduce external components and simplify signal integrity management.
On-Chip Memory and System Design
A substantial amount of Blok RAM is available for buffering, packet queues, and local memory for the embedded processors. This helps reduce external memory access, improves latency control, and supports consistent performance in real-time systems.
The Virtex-5 FXT platform is supported by a mature Xilinx toolchain and a wide range of proven IP cores, which remains valuable for long-life products and maintenance-oriented projects.
Package and Industrial Temperature Grade
Bu 1738-ball flip-chip BGA package provides a very high pin count, allowing flexible I/O assignment and support for interface-dense board designs.
Bu industrial temperature grade (I) ensures reliable operation across extended temperature ranges, making this device suitable for industrial automation, outdoor communication equipment, and other demanding environments.
Tipik Uygulamalar
The XC5VFX130T-1FF1738I is commonly used in:
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Telecommunications and networking infrastructure
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Embedded processing platforms with hardware–software co-design
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Industrial control and automation systems
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High-speed data acquisition and signal processing equipment
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Long-life and legacy system support
