| 모델 P/N | 시리즈 | 실험실/CLBS 수 | 속도 등급 | 논리 요소/셀 수 | 총 램 비트 | I/O 수 | 전압 - 공급 | 마운팅 유형 | 작동 온도 | 패키지 / 케이스 | 공급업체 디바이스 패키지 |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC5VFX130T-1FF1738I | Virtex-5 FXT | 10.240,00 | -1,00 | 131072 | 10985472 | 840 | 0.95V-1.05V | 표면 실장 | -40°C ~ +100°C | 1738-FBGA, FCBGA | 1738-FCPBGA(42.5×42.5mm) |
XC5VFX130T-1FF1738I – Xilinx Virtex-5 FXT FPGA
그리고 XC5VFX130T-1FF1738I 의 고용량 FPGA입니다. 자일링스 버텍스-5 FXT 제품군, 다음이 필요한 시스템을 위해 설계되었습니다. embedded processing, high-speed serial interfaces, and a large logic fabric 단일 디바이스 내에서 사용할 수 있습니다. 에서 LXB 세미콘, this part is typically supplied for industrial and communications platforms that value architectural maturity, predictable timing, and long-term availability.
로직 리소스 및 임베디드 처리
The XC5VFX130T provides approximately 130K logic cells, offering sufficient capacity for complex datapaths, multi-channel data processing, and custom hardware acceleration. A key characteristic of the FXT family is the integration of 듀얼 PowerPC® 440 프로세서, enabling designers to implement control logic, protocol handling, and real-time system management directly inside the FPGA.
그리고 속도 등급 -1 emphasizes stable and well-characterized timing performance, making it suitable for designs where reliability and deterministic behavior are more important than maximum clock frequency.
High-Speed Serial Communication
This device integrates RocketIO™ GTX 트랜시버, supporting high-speed serial standards such as PCI Express, Serial RapidIO, Gigabit Ethernet backplanes, and proprietary point-to-point links. By integrating the serial interfaces on-chip, system designers can reduce external components and simplify signal integrity management.
온칩 메모리 및 시스템 설계
A substantial amount of 블록 RAM is available for buffering, packet queues, and local memory for the embedded processors. This helps reduce external memory access, improves latency control, and supports consistent performance in real-time systems.
The Virtex-5 FXT platform is supported by a mature Xilinx toolchain and a wide range of proven IP cores, which remains valuable for long-life products and maintenance-oriented projects.
Package and Industrial Temperature Grade
그리고 1738-ball flip-chip BGA package provides a very high pin count, allowing flexible I/O assignment and support for interface-dense board designs.
그리고 산업용 온도 등급(I) ensures reliable operation across extended temperature ranges, making this device suitable for industrial automation, outdoor communication equipment, and other demanding environments.
일반적인 애플리케이션
The XC5VFX130T-1FF1738I is commonly used in:
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Telecommunications and networking infrastructure
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하드웨어와 소프트웨어가 공동 설계된 임베디드 프로세싱 플랫폼
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Industrial control and automation systems
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High-speed data acquisition and signal processing equipment
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Long-life and legacy system support
