XC4VLX40-10FFG668C

Üretici firma: Xilinx
Mantık Hücreleri: 40,960
Mantık Dilimleri: 2,560
Gömülü RAM (eRAM): 1,728 Kb
Paket: FFG668
Çalışma Sıcaklığı: Ticari (0°C ila +85°C)

BIZE MESAJ GÖNDERIN

    Teknik Özellikler

    MODEL P/N SERİLER LABORATUVAR/CLB SAYISI HIZ DERECESİ MANTIK ELEMANI / HÜCRE SAYISI TOPLAM RAM BİTLERİ G/Ç SAYISI VOLTAJ - BESLEME MONTAJ TİPİ ÇALIŞMA SICAKLIĞI PAKET / KASA TEDARIKÇI CIHAZ PAKETI
    XC4VLX40-10FFG668C Virtex-4 LX 4.608,00 -10,00 41472 1769472 448 1,14 V ~ 1,26 V Yüzey Montajı 0 °C ~ +85 °C (Ticari) 668-BBGA (FCBGA) 668-FCBGA

    XC4VLX200-10FFG1513C: High-Capacity Logic Integration for Commercial Computing Platforms

    Bu XC4VLX40-10FFG668C is a high-performance member of the Xilinx Virtex®-4 LX family, optimized for logic-intensive commercial applications. Built on the proven 90nm ASMBL™ (Gelişmiş Silikon Modüler Blok) architecture, this FPGA delivers a robust 41k logic cell fabric that bridges the gap between low-cost entry-level chips and high-end workstation-class silicon.

    Evin içinde FFG668 Lead-Free package, it provides a versatile I/O-to-logic ratio, making it the ideal choice for high-speed data bridging, localized signal processing, and system-level control.

    Temel Mühendislikte Öne Çıkanlar

    • Efficient Logic Density: ile 41,472 Logic Cells, this device is tailored for designs that require complex state machines and custom RTL without the power overhead of oversized FPGAs.

    • XtremeDSP™ Capability: Includes 64 dedicated DSP48 slices. These hard-coded blocks allow for high-speed arithmetic (up to 400MHz+) without taxing the general-purpose logic fabric, perfect for real-time filtering and digital modulation.

    • Optimize Edilmiş Bellek Hiyerarşisi: İle donatılmıştır 1,728 Kb of Block RAM (BRAM). The dual-port nature of this memory is essential for implementing high-speed FIFOs and local data caching in streaming applications.

    • Superior Signal Integrity: Bu FFG668 paketi offers 448 Kullanıcı I/O'ları. The Flip-Chip (FFG) technology minimizes parasitic inductance, reducing Eşzamanlı Anahtarlama Gürültüsü (SSN)—a critical factor when driving high-speed parallel buses like DDR2 or QDR SRAM.

    • Digital Clock Management (DCM): Features advanced clocking resources that provide sub-nanosecond skew control and frequency synthesis, ensuring stable timing closure across the entire 668-pin array.


    Teknik Özellikler Matrisi

    Özellik Şartname
    Mantık Hücreleri 41,472
    CLB Dizisi 4,608
    Toplam Blok RAM 1,728 Kb
    DSP48 Dilimleri 64
    Maksimum Kullanıcı G/Ç 448
    Hız Sınıfı -10 (Standart Performans)
    Paket FFG668 (Lead-Free / 1.0mm Pitch)
    Sıcaklık Sınıfı Ticari (0°C ila +85°C)